A resist underlayer film forming composition wherein a flat film forms exhibiting high etching resistance, a good dry etching rate ratio and optical constant, has good coverage, and a small difference in film thickness after embedding. Also included are a resist underlayer film using the resist underlayer film forming composition; and a method for producing a semiconductor apparatus. This resist underlayer film forming composition includes: at least one compound of formula (A); at least one polymer of formula (B); and a solvent. (In formula (A), X represents a C2-C50 n-valent organic group, and n Y's represent a C6-C60 aromatic hydrocarbon group having at least one hydroxyl group, n represents an integer of 1-4.) [In formula (B), R1 represents a hydrogen atom or methyl group, and R2 represents at least one group from formulae (B-1) to (B-3). (In formulae (B-1) to (B-3), * represents a bond with an adjacent oxygen atom.)]

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.

An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

A pressure sensitive adhesive construct comprising: (A) a backing substrate; and (B) a pressure sensitive adhesive composition disposed on the backing substrate, wherein the pressure sensitive adhesive composition includes an ultraviolet radiation-cured polymer made from: (a) at least one epoxidized plant oil, at least one epoxidized animal fat, or a mixture thereof; (b) at least one dicarboxylic acid, at least one polycarboxylic acid, or a mixture thereof; and (c) at least one compound that contains both one carbon-carbon double bond (C═C) and at least one carboxylic acid group.

The present application relates to a coating composition and wood article manufactured therefrom, the coating composition comprising: (A) a film-forming resin composition comprising a reactive donor capable of providing two or more nucleophilic carbanions, and a reactive acceptor comprising two or more carbon-carbon double bonds; (B) a catalyst for catalyzing the Michael addition crosslinking reaction between the reactive donor and the reactive acceptor, wherein the reactive donor has an aromatic epoxy backbone, and wherein the reactive donor has an epoxy equivalent weight in the range of from 400 to 1100 g/mol, preferably in the range of from 470 to 1000 g/mol, more preferably in the range of from 470 to 900 g/mol.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Provided are poly(AAG)-compositions, and corresponding coatings, foams, and coated articles. Also provided are methods for preparing the poly(AAG)-compositions and corresponding reagents including, e.g., polyol-AAG compositions. Coatings using the poly(AAG)-compositions may be useful for, e.g., replacing bisphenol-A cross-linked coatings used in food and beverage containers, coating metal articles, and the like.

The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.

An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30 and at least one polymer obtained from the polymerization of one or more ethylenically unsaturated monomers and their use for forming coatings or binder agents, especially for decorative and protective coating applications on various substrates.