Provided is a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and an encapsulating composition that can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into an organic electronic device, thereby securing a lifetime of the organic electronic device, and that can be applied to a top-emitting organic electronic device to prevent physical and chemical damage of organic electronic elements, while having excellent optical properties and processability, and an organic electronic device comprising the same.

To provide 3,4-epoxycyclohexylmethyl methacrylate that is highly pure and that is useful as a raw material for functional materials or optical members having excellent transparency and heat resistance. An alicyclic epoxy compound product having a purity of 3,4-epoxycyclohexylmethyl methacrylate of 98.0 wt. % or greater and a total content of a compound represented by Formula (a) below and a compound represented by Formula (b) below of 1.3 wt. % or less. This alicyclic epoxy compound product preferably has a Hazen color number of 25 or less.

A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.

A release agent is disclosed for use with an organic binder system used in metal casting. The binder system has a Part I component including an epoxy resin and a free radical initiator and a Part II component having an epoxy resin and an acrylate, where the Part I and Part II components are kept separate until the time of use. The release agent will typically have a molecular weight in the range of 150 to 160, with eight to ten carbon atoms. Two examples of the epoxide are pinene oxide and decene-1 oxide, each of which is effective as an internal release agent when present in the binder for a cold box process in the range of about 0.15% to about 1% of the total weight of the Part I and Part II components.

An epoxy resin composition comprises components [A] to [C]. The component [C] is a component [c1] or [c2] and the rubbery state elastic modulus of a cured article produced by curing the epoxy resin composition in a dynamic viscoelasticity evaluation is 10 MPa or less. Component[A] is a phenyl glycidyl ether substituted by a tert-butyl group, a sec-butyl group, an isopropyl group or a phenyl group. Component [B] is a bifunctional or higher aromatic epoxy resin. Component [C] is a curing agent selected from component [c1], which is an acid anhydride-type curing agent and component [c2], which is an aliphatic amine-type curing agent.

Lost circulation material (LCM) compositions for sealing lost circulation zones in wellbores may include an epoxy resin, a curing agent, an amide accelerator, and calcium carbonate having an average particle size of from 1,000 microns to 10,000 micron. The epoxy resin includes at least one of 2,3-epoxypropyl-o-tolyl ether, C12-C14 alkyl glycidyl ether, 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, or cyclohexanedimethanol diglycidyl ether. The epoxy resin can also include bisphenol-A-epichlorohydrin epoxy resin. Methods of treating a lost circulation zone of a wellbore include injecting the LCM compositions into the lost circulation zone and curing the LCM compositions, where the LCM compositions include an epoxy resin, a curing agent, an amide accelerator, and calcium carbonate having an average particle size of from 1,000 microns to 10,000 microns.

An epoxy resin composition is provided which comprises an epoxy resin and a reactive diluent comprising one or more of the monoesters of epoxidized soy oil characterized by a ratio of mols of epoxide groups to mols of ester on the whole of at least 1.35:1. A thermoset plastic composition is also provided which comprises an epoxy resin composition as described, with an amine curing agent.

An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includes components (A) to (C): component (A): an epoxy resin (excluding the following component (B)); component (B): an epoxy resin having one epoxy group in a molecule and a surface tension of from 28.5 to 35.0 mN/m; and component (C): a latent curing agent.

A water soluble polymer or polymeric adduct has a backbone comprising a plurality of segments with amine functional groups and hydroxyl functional groups with a number average molecular weight of about 5.00 to 1,000,000 Daltons. The polymeric adduct may be formed as an addition product by reacting at least one multifunctional amine compound reacted with a one or more polyfunctional epoxy compounds and/or one or more monofunctional epoxy compounds, such that there are 1.3 to 3.8 reactive amine functional groups per reactive epoxy functional group. An aqueous solution of the polymer or polymeric adduct has a viscosity of about 100 centipoise to 100,000 centipoise and a pH value of about 8 to 12 when the solution comprises 70 wt. % of the polymer or polymeric adduct dissolved in water. The polymeric adducts are useful fast setting additives for emulsions due to excellent stability when blended with anionically stabilized latex.

The present application relates to an encapsulating composition, an organic electronic device, a method for evaluating reliability of the organic electronic device and a method for preparing the organic electronic device, and provides an encapsulating composition which can improve flatness and adhesion of an organic layer sealing an organic electronic element to effectively block moisture or oxygen introduced into an organic electronic device from the outside, thereby securing the lifetime of the organic electronic device.