Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.

Provided is a Fresnel lens which has excellent heat resistance and which can covert light even from a poor-quality semiconductor light sources into uniform, high-quality light and can disperse the resulting light without lowering the central illuminance. The Fresnel lens according to the present invention includes two or more sawtooth prisms in a surface thereof and is made of a cured product of a curable composition containing an epoxy compound (A). Of the sawtooth prisms, a sawtooth prism having a longest inclined side in a cross section has a roughened surface, where the cross section is given by cutting the Fresnel lens in a plane which passes through the center of the Fresnel lens and which is perpendicular to a reference plane of the Fresnel lens.

A curable composition includes (A) a first component having from 5.0 wt % to 39.0 wt %, based on the total weight of the first component, of a toughening agent component including a Bisphenol F based epoxy resin and an urethane acrylate component, a hardener component having at least one amine based hardener and is present in a ratio of 0.8 to 1.2, based on a number of equivalents of amino hydrogen groups in the hardener component to a number of equivalents of reactive groups in the first component capable of forming a covalent link with the amine reactive groups in the hardener, and an epoxy base component that accounts for a remainder of the total weight of the first component and that has at least one epoxy resin separately provided from the Bisphenol F based epoxy resin. The Bisphenol F based epoxy resin is present in an amount from 2.5 wt % to 50.0 wt % and the urethane acrylate component is present in an amount from 50.0 wt % to 97.5 wt %, based on the total weight of the toughening agent component. The urethane acrylate component includes the capping reaction product of an acrylate and an isocyanate terminated prepolymer and the isocyanate-terminated prepolymer is the reaction product of a polyisocyanate and at least a DMC derived polyol having a molecular weight of at least 3000 g/mol. The curable composition may further include (B) an optional second component that has at least one of a filler and any additional ingredient for a targeted application of the curable composition.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

The purpose of the present invention is to provide a surface sealing material which has high storage stability and is capable of forming, on an object to be coated such as an organic EL element, a cured product layer that has less irregularity, cissing and the like, while having high surface smoothness. A surface sealing material for organic EL elements according to the present invention contains (B) a cationically polymerizable compound that comprises a cationically polymerizable functional group in each molecule and has a structure represented by formula (1) —(R—O).sub.n— (wherein R represents an alkylene group having 2-5 carbon atoms and n represents an integer of 1-150), (C) a thermal cationic polymerization initiator and (D) a leveling agent.

The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows:

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and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

A multilayer coil device includes an element formed by laminating a coil conductor and a magnetic element body. The magnetic element body includes soft magnetic particles and an epoxy resin. The soft magnetic particles include soft magnetic metal particles. The epoxy resin has an epoxy value of 150 or less. The epoxy resin is filled in gap spaces between the soft magnetic particles.

A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.

Provided are an epoxy resin composition and a film or a molding material. The epoxy resin composition is an epoxy resin composition including the following components A to D: component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; component B: an epoxy resin that is liquid at 30° C.; component C: a diblock copolymer having a B-M structure (where M represents a block formed of a homopolymer of methyl methacrylate or a copolymer containing at least 50 wt % of methyl methacrylate, B represents a block that is incompatible with the epoxy resins and the block M, and that has a glass transition temperature Tg of 20° C. or less, and respective blocks represented by B and M are directly bonded to each other or are linked to each other through a linking group); and component D: an amine-based curing agent that is dicyandiamide or a derivative thereof.

A dispersion includes a hyperbranched polymer having latent crosslinking functionality and comprising the reaction product of: a partially neutralized, acid-functional resin; and an epoxy; and optionally, an effective amount of a crosslinking agent; wherein: the partially neutralized, acid-functional resin comprises the reaction product of a mixture of: a first acid-functional resin with a base and a second acid-functional resin; or a first and a second acid-functional resin with a base; the first acid-functional resin is not the same as the second acid-functional resin; at least one of the acid functional resins comprises a further functional group capable of Schiff-Base crosslinking after film formation; and the dispersion is a single pack waterborne polymer dispersion.