Provided are a curable composition which is rapidly curable and which gives cured products with good heat resistance, a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin-molded article, and a method for manufacturing the fiber-reinforced resin-molded article. Provided are a curable composition containing an epoxy resin (A), an aliphatic and/or alicyclic amine compound (B), and an imidazole compound (C), wherein the ratio H/E of the number of moles H of active hydrogen in the aliphatic and/or alicyclic amine compound (B) to the number of moles E of an epoxy group in the epoxy resin (A) is in the range of 0.2 to 0.9; a cured product thereof; a fiber-reinforced composite material; a fiber-reinforced resin-molded article; and a method for manufacturing the fiber-reinforced resin-molded article.

A dust core includes a binder and magnetic particles. The binder includes an epoxy resin. The magnetic particles are dispersed in the binder. The epoxy resin has at least two or more mesogenic skeletons between two epoxy bonds adjacent along a molecular chain.

An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

The disclosure provides a cationic curing composition for a plastic substrate, a coating material including the composition and an application of the composition in the field of energy curing. The cationic curing composition includes a polyhydroxy resin, an epoxy compound, an oxetanyl-containing compound, and a cationic initiator, the polyhydroxy resin is a polyester resin, an acrylic resin and/or a phenolic resin, and the molar ratio of a hydroxyl, a three-membered epoxy group to a four-membered epoxy group in the cationic curing composition is 1:(3-20):(1-25). A plastic product includes the plastic substrate and a coating layer, and the coating layer is formed by curing the cationic curing composition.

The disclosure provides a cationic curing composition for a plastic substrate, a coating material including the composition and an application of the composition in the field of energy curing. The cationic curing composition includes a polyhydroxy resin, an epoxy compound, an oxetanyl-containing compound, and a cationic initiator, the polyhydroxy resin is a polyester resin, an acrylic resin and/or a phenolic resin, and the molar ratio of a hydroxyl, a three-membered epoxy group to a four-membered epoxy group in the cationic curing composition is 1:(3-20):(1-25). A plastic product includes the plastic substrate and a coating layer, and the coating layer is formed by curing the cationic curing composition.

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties. ##STR00001##

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa.Math.s.

The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa.Math.s.

A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.