A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.

A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.

A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.

A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.

The present teachings generally provide a system comprising a pultruded profile and a two-part system with a first component including one or more epoxy resins and a second component including one or more phosphate esters such that mixing the first component and second component forms an activatable material that activates at a temperature of about 0° C. to about 50° C. The activatable material is extruded onto the pultruded profile such that residual heat from pultrusion in the pultruded profile activates the activatable material.

The present teachings generally provide a system comprising a pultruded profile and a two-part system with a first component including one or more epoxy resins and a second component including one or more phosphate esters such that mixing the first component and second component forms an activatable material that activates at a temperature of about 0° C. to about 50° C. The activatable material is extruded onto the pultruded profile such that residual heat from pultrusion in the pultruded profile activates the activatable material.

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

The invention relates to a method for preparing an epoxy prepolymer composition comprising glycidyl ethers, said method comprising the following steps: a) placing a dianhydrohexitol into contact with another alcohol so as to obtain a composition of alcohols; b) reacting the composition of alcohols obtained in step a) with an epihalohydrin so as to obtain a reaction mixture comprising glycidyl ethers; c) recovering the epoxy prepolymer composition comprising glycidyl ethers from the reaction mixture obtained at the end of step b);
The invention also relates to an epoxy prepolymer composition that can be obtained by said method, a curable composition comprising said epoxy prepolymer composition, a polyepoxide obtained by curing said curable composition and a composite material, coating or adhesive comprising said polyepoxide.

The present disclosure relates to compositions derived from bioreachable molecules, such as amino acids or hydroxy acids. In particular, the composition can be a monomer, a polymer, or a copolymer derived from an amino acid dimer or a hydroxy acid dimer.