A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.

A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.

A compound represented by the following formula (1): ##STR00001##
wherein R.sup.1 is a monovalent organic group containing a polyether chain; X.sup.1 and X.sup.2 are each individually a monovalent group; and the polyether chain is a chain represented by the following formula: —(OC.sub.6F.sub.12).sub.m11—(OC.sub.5F.sub.10).sub.m12—(OC.sub.4F.sub.8).sub.m13—(OC.sub.3X.sup.10.sub.6).sub.m14—(OC.sub.2F.sub.4).sub.m15—(OCF.sub.2).sub.m16—, wherein m11, m12, m13, m14, m15, and m16 are each individually an integer of 0 or 1 or greater; X.sup.10s are each individually H, F, or Cl; the repeating units are present in any order; and the sum of m11 to m16 is an integer of 10 or greater, R.sup.1 being other than those containing a urethane bond.

A heat dissipating paint composition for forming a heat dissipating coating is disclosed. The heat dissipating paint includes a prepolymer and a curing agent. The prepolymer includes a main chain containing an epoxy resin and a linear side chain bonded to the main chain and having 5 to 101 carbon atoms.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

The present invention provides an epoxy resin composition containing:

an epoxy resin [A] that is a compound represented by Chemical formula (1) shown below:

##STR00001##

wherein R.sub.1 to R.sub.4 each independently represent one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and a halogen atom, and X represents one selected from —CH.sub.2—, —O—, —S—, —CO—, —C(═O)O—, —O—C(═O)—, —NHCO—, —CONH—, and —SO.sub.2—;

a bifunctional epoxy resin [B] having an amine type glycidyl group;

a curing agent [C] containing an aromatic polyamine, and having at least one substituent selected from an aliphatic substituent, an aromatic substituent, and a halogen atom at an ortho position with respect to an amino group; and

a particulate rubber component [D].

Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are a gas barrier film and a laminate in which the epoxy resin composition is used.

Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are a gas barrier film and a laminate in which the epoxy resin composition is used.

A copolymer is formed by reacting a composition I, which includes (a) a first epoxy compound having a chemical structure of

##STR00001##

wherein R.sup.1 is single bond, —O—,

##STR00002##

(b) a second epoxy compound that is different from (a) the first epoxy compound, and (c) a curing agent. The copolymer can be mixed with inorganic powder to form a composite material.