An epoxy composition is provided that includes a polyepoxy aniline, a rheology modifier, a filler, and a polyamine hardener comprising a cyclic hydrocarbon-containing polyamine. When cured, the epoxy composition provides an advantageous chemical resistance at high temperatures and pressures. Additionally, the cured epoxy compositions have good adhesion to substrates and resist blistering.

Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V.sub.2/V.sub.1 in the range of 5.0×10.sup.−2 to 1.0×10.sup.2, wherein V.sub.1 (dPa.Math.s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V.sub.2 (dPa.Math.s) is the minimum value of the melt viscosity measured at 60° C. to 100° C. in accordance with JIS-K7244-10:2005, and a pencil hardness of HB or more measured by a pencil hardness test according to JIS-K5600-5-4:1999 in a state of heating at 100° C. for 160 minutes.

A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×10.sup.3 to 2.0×10.sup.8 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin comprising a m- or p-aminophenol epoxy resin [b1] and either a glycidyl ether epoxy resin or a glycidyl amine epoxy resin [b2] that has two or more glycidyl groups in a molecule, [C] curing agent, and [D] thermoplastic resin.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

The present invention provides a cationic electrodeposition coating composition with a rust prevention property enhanced by improving the adhesion and the blocking property of a coating film obtained from a cationic electrodeposition coating composition as compared with conventional ones. The present invention provides a cationic electrodeposition coating composition including an aminated epoxy resin and a blocked polyisocyanate curing agent, wherein the aminated epoxy resin is an aminated epoxy resin obtained by reacting an amine compound with an epoxy resin, the aminated epoxy resin has a molecular weight distribution of 2.7 or less, and a rate of elongation of an electrodeposition coating film formed by applying the cationic electrodeposition coating composition to a steel sheet such that a cured film thickness is 20 μm, followed by baking at 160° C. for 15 minutes, is 0.1 to 4.5%.

The present invention provides a cationic electrodeposition coating composition with a rust prevention property enhanced by improving the adhesion and the blocking property of a coating film obtained from a cationic electrodeposition coating composition as compared with conventional ones. The present invention provides a cationic electrodeposition coating composition including an aminated epoxy resin and a blocked polyisocyanate curing agent, wherein the aminated epoxy resin is an aminated epoxy resin obtained by reacting an amine compound with an epoxy resin, the aminated epoxy resin has a molecular weight distribution of 2.7 or less, and a rate of elongation of an electrodeposition coating film formed by applying the cationic electrodeposition coating composition to a steel sheet such that a cured film thickness is 20 μm, followed by baking at 160° C. for 15 minutes, is 0.1 to 4.5%.

Disclosed are various polymer solid electrolyte materials suitable for various electrochemical devices and methods for making or using the same. The polymer solid electrolyte comprises a crosslinked polymer from a polymer. Certain embodiments are generally directed to solid electrolytes having relatively high ionic conductivity and/or other mechanical or electrical properties, e.g., tensile strength or decomposition potential. Certain aspects include a polymer, a plasticizer, and an electrolyte salt. In some cases, the polymer for synthesizing the crosslinked polymer may exhibit certain structures such as:

##STR00001##

where R.sub.1 can be one of the following groups:

##STR00002##

where n is an integer between 1 and 10000, m is an integer between 1 and 5000, and R.sub.2 to R.sub.6 can each independently be one:

##STR00003##

selected from the group consisting of hydrogen, methyl, ethyl, phenyl, benzyl, acryl, epoxy ethyl, isocyanate, cyclic carbonate, lactone, lactam, and vinyl; and * indicates a point of attachment.

Disclosed are various polymer solid electrolyte materials suitable for various electrochemical devices and methods for making or using the same. The polymer solid electrolyte comprises a crosslinked polymer from a polymer. Certain embodiments are generally directed to solid electrolytes having relatively high ionic conductivity and/or other mechanical or electrical properties, e.g., tensile strength or decomposition potential. Certain aspects include a polymer, a plasticizer, and an electrolyte salt. In some cases, the polymer for synthesizing the crosslinked polymer may exhibit certain structures such as:

##STR00001##

where R.sub.1 can be one of the following groups:

##STR00002##

where n is an integer between 1 and 10000, m is an integer between 1 and 5000, and R.sub.2 to R.sub.6 can each independently be one:

##STR00003##

selected from the group consisting of hydrogen, methyl, ethyl, phenyl, benzyl, acryl, epoxy ethyl, isocyanate, cyclic carbonate, lactone, lactam, and vinyl; and * indicates a point of attachment.

The present invention generally relates to various polymer solid electrolyte materials suitable for various electrochemical devices and methods for making or using the same. Certain embodiments of the invention are generally directed to solid electrolytes having relatively high ionic conductivity and/or other mechanical or electrical properties, e.g., tensile strength or decomposition potential. Certain aspects include a polymer, a plasticizer, and an electrolyte salt. In some cases, the polymer may exhibit certain structures such as:

##STR00001##

where R.sub.1 can be one of the following groups:

##STR00002##

where n is an integer between 1 and 10000, m is a integer between 1 and 5000, and R.sub.2 to R.sub.6 can each independently be one of the following structures:

##STR00003##