The present invention generally relates to various polymer solid electrolyte materials suitable for various electrochemical devices and methods for making or using the same. Certain embodiments of the invention are generally directed to solid electrolytes having relatively high ionic conductivity and/or other mechanical or electrical properties, e.g., tensile strength or decomposition potential. Certain aspects include a polymer, a plasticizer, and an electrolyte salt. In some cases, the polymer may exhibit certain structures such as:

##STR00001##

where R.sub.1 can be one of the following groups:

##STR00002##

where n is an integer between 1 and 10000, m is a integer between 1 and 5000, and R.sub.2 to R.sub.6 can each independently be one of the following structures:

##STR00003##

The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa.Math.s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.

The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa.Math.s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

A highly thermally conductive epoxy compound, and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package, each including the highly thermally conductive epoxy compound. The epoxy compound is represented by Chemical Formula 1 below and has at least one mesogenic naphthalene unit.
E.sub.1-M.sub.1-L.sub.1-M.sub.2-L.sub.2-M.sub.3-E.sub.2  Chemical Formula 1 In Chemical Formula 1, at least one of M.sub.1, M.sub.2, or M.sub.3, which are mesogenic units, is a naphthalene unit. M.sub.1, M.sub.2, M.sub.3, L.sub.1, L.sub.2, and E.sub.1 and E.sub.2 are as defined in the detailed description.

A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.