Patent classifications
C08G59/3209
STRETCHABLE RESIN COMPOSITION, AND RESIN SHEET MATERIAL, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD EACH INCLUDING OR OBTAINED USING SAME
An aspect of the present invention relates to a stretchable resin composition containing an epoxy resin and a curing agent, in which the epoxy resin has a weight average molecular weight of 50,000 or more and 3,000,000 or less and a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1): 1.1Mw/Mn3.0(1) (wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight), the curing agent is a crystalline compound, and a glass transition temperature of a cured product of the stretchable resin composition is 60 C. or less.
ULTRA-VIOLET CURABLE ACRYLIC PRESSURE SENSITIVE ADHESIVES
An ultra-violet (UV) curable acrylic pressure sensitive adhesive (PSA) with high cohesive strength and high bio-content is described. The PSA has versatile cure profile and can be cured by conventional mercury bulbs or UV LED lamps and is particularly useful as a high-performance tape. In addition, the PSA is suitable for low temperature processing, particularly from room temperature to 120 C.
Pendant Epoxide Polymers and Methods of Treating Subterranean Formations
This document relates to compositions including a crosslinkable polymer including a pendant epoxide repeat unit and an amine crosslinker, and methods of treating a subterranean formation by providing the composition to the formation. The pendant epoxide repeat unit has the structure
##STR00001##
Each R.sup.1 is independently a (C.sub.1-C.sub.10) alkylene or (C.sub.1-C.sub.10) alkylene ether, each alkylene ether independently having a ratio of carbon atoms to oxygen atoms of 1:1 to 4:1.
Method for synthesis of polymer containing multiple epoxy groups
A method for a synthesis of a polymer containing multiple epoxy groups includes steps of: under protection of nitrogen or argon, with a photosensitive free radical initiator under an ultraviolet light irradiation, initiating a mixture of a dithiol compound and alkynyl glycidyl ether or other alkynyl-containing compounds to proceed a thiol-yne polymerization, so as to obtain the polymer. The number of the epoxy groups is able to be adjusted through changing a type of a dithiol monomer, a mixing ratio of the dithiol monomer, and a mixing ratio between the alkynyl glycidyl ether and other alkynyl compounds. The present invention has advantages of: fast reaction, convenient process, easy post-processing, a large number of the epoxy groups, and adjustable and controllable content. The obtained polymer has a wide potential application in fields of coating, adhesive, ink, encapsulating material, resin for composite material, additive, high performance material, function material, and so on.
EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME
An object is to provide an epoxy resin composition for resin transfer molding (RTM) having a low viscosity and low volatility and excellent in balance among elastic modulus at the time of wet heating, heat resistance at the time of wetting, and fracture toughness of a cured resin of the epoxy resin composition, and to provide a large fiber-reinforced composite material having a high Vf and including the epoxy resin composition. An epoxy resin composition for RTM including a component [A], a component [B], and a component [C] described below: [A] a tetrafunctional glycidyl amine type epoxy resin, [B] at least one aromatic amine curing agent selected from the group consisting of an alkylbenzenediamine and a methylenebisaniline, [C] an aniline type epoxy resin represented by Formula (I):
##STR00001## wherein R.sup.1 and R.sup.2 each represent at least one selected from aliphatic hydrocarbon groups having a carbon number of 1 or more and 4 or less, in a case where a plurality of R's are present, the plurality of R's are identical or different, in a case where a plurality of R.sup.2s are present, the plurality of R.sup.2s are identical or different, n is an integer of 0 or more and 4 or less, m is an integer of 0 or more and 5 or less, and X represents O or S, the epoxy resin composition for RTM satisfying all of Condition 1 to Condition 4 described below: Condition 1: in the epoxy resin composition for RTM, a viscosity at 110 C. is 1 mPa.Math.s or more and 200 mPa.Math.s or less, Condition 2: in the epoxy resin composition for RTM, a mass reduction rate after heating the epoxy resin composition for RTM at 110 C. for 30 minutes is 0.3 mass % or less, Condition 3: a cured resin obtained by curing the epoxy resin composition for RTM at 180 C. for 2 hours has a rubbery state elastic modulus of 2 MPa or more and 8 MPa or less, Condition 4: a cured resin obtained by curing the epoxy resin composition for RTM at 180 C. for 2 hours has a water absorption coefficient of 1% or more and 3% or less.
Stretchable resin composition, and resin sheet material, metal foil with resin, metal-clad laminate, and wiring board each including or obtained using same
An aspect of the present invention relates to a stretchable resin composition containing an epoxy resin and a curing agent, in which the epoxy resin has a weight average molecular weight of 50,000 or more and 3,000,000 or less and a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1): 1.1Mw/Mn3.0(1) (wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight), the curing agent is a crystalline compound, and a glass transition temperature of a cured product of the stretchable resin composition is 60 C. or less.