Various embodiments may include low-creep and low-stress-relaxation polymer composites (or reduced-creep and reduced-stress-relaxation polymer composites) and methods for making low-creep and low-stress-relaxation polymer composites (or reduced-creep and reduced-stress-relaxation polymer composites). Various embodiments may include a polymeric material, comprising: a tetrafunctional epoxy in an epoxy weight amount; an amine hardener in a hardener weight amount, wherein a weight ratio of the epoxy weight amount to the hardener weight amount is 1:0.38 or greater; and an oligomer additive in an additive concentration, the oligomer additive comprising a monomer combined with 4′-hydroxyacetanilide (HAA).

The present invention aims to provide a resin composition which can form a cured product having a high adhesive property and a high thermal conductivity. A resin composition containing an epoxy compound (A), an amine curing agent (B) and a thermally conductive filler (C), wherein the epoxy compound (A) is in a liquid form and wherein the amine curing agent (B) contains a benzoxazole skeleton.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.

Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound;
0.20≤b/a≤0.60; and  (i)
0.002≤c/a≤0.014;  (ii)
wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).

The present invention relates to preparation of heterogeneous mixtures of (carboxylated) vinyl ester/ethylene dispersions, such as vinyl acetate/ethylene (VAE) dispersions with polyamideamine-epichlorohydrin (PAE) wet strength resins having a reduced amount of halogenated organic compounds, such as less than 1500 ppm. The dispersion offers extremely low free and bound formaldehyde levels combined with wet tensile strength for use in non-woven textile and paper applications.

An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.

A curable composition comprises: 1 to 65 percent by weight of polyepoxide comprising an addition reaction product of phenolphthalein and bisphenol A diglycidyl ether; 5 to 50 percent by weight of liquid polyepoxide; and an effective amount of curative for curing the curable composition. A curable adhesive film comprising the curable composition, and method of bonding are also disclosed.

A composition for forming a thermally conductive material contains a compound represented by General Formula (1), a phenolic compound, and an inorganic substance, in which a content of the compound represented by General Formula (1) is 30.0% by mass or greater with respect to a total organic solid content,

(X—Z.sup.1—).sub.m-A-(—Z.sup.2—Y).sub.n  (1).

A thermoset precursor composition includes a backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain, and at least one of: an epoxy group terminating the backbone or an aldehyde group terminating the backbone. The thermoset precursor can have at least two epoxy groups, one epoxy group and one aldehyde group, or two aldehyde groups.