Patent classifications
C08G59/3236
COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL
A first object of the present invention is to provide a composition capable of forming a cured product (thermally conductive material) having excellent thermal conductivity. In addition, a second object of the present invention is to provide a thermally conductive material formed from the composition and a device with a thermally conductive layer. In addition, a third object of the present invention is to provide a method for manufacturing a thermally conductive material using the composition.
The composition of the present invention includes a curing agent including an active hydrogen-containing functional group, and a main agent including a reactive group which reacts with the active hydrogen-containing functional group, in which the main agent and the curing agent respectively exhibit liquid crystallinity in a single state at a temperature of 150 C. or lower.
Bio-based thermosets
The invention relates to novel curable bio-based thermosetting compositions of a) at least one highly-functional bio-based epoxy resin; and b) at least one carboxylic acid crosslinker selected from the group consisting of a water-soluble multifunctional carboxylic acid, a dicarboxylic acid oligomer from a melt reaction between a diol and a dicarboxylic acid or its anhydride, and mixtures thereof and which are curable with water, an alcohol or a water and alcohol mixture. The bio-based thermosets of the invention may be free of VOCs and/or organic solvents. The bio-based thermosets of the invention can be used to form coatings, composites, adhesives, and films. Methods of making the bio-based thermosets of the invention are disclosed as are coating compositions and coated objects, such as coatings, composites, adhesives, and films, using the bio-based thermosets of the invention.
RENEWABLE FURAN BASED AMINE CURING AGENTS FOR EPOXY THERMOSET
The present invention relates novel furan based amine cross-linkers with improved thermomechanical and water barrier properties. The novelty of this invention is the use of aromatic, and hydrophobic aliphatic aldehydes to bridge two furfuryl amines, which yields a diamine or tetra amines with a significantly enhanced hydrophobic character. These diamine cross-linkers exhibit enhanced water barrier properties and thermomechanical properties when cured with both commercial and synthetic epoxies.
Curable composition, cured film, display panel, and method for producing cured product
A curable composition having satisfactory curability, capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, a cured film made of a cured product of the curable composition, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a thermal cationic polymerization initiator, the curable compound contains a cationic polymerizable compound containing, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and the thermal cationic polymerization initiator contains a quaternary ammonium salt-type compound having a specific structure.
COMPOUND, RESIST COMPOSITION CONTAINING COMPOUND AND PATTERN FORMATION METHOD USING SAME
A resist composition comprising one or more tannin compounds selected from the group consisting of a tannin comprising at least one crosslinking reactive group in the structure and a derivative thereof, and a resin obtained using the tannin or the derivative as a monomer.
Sugar based epoxy resins with enhanced properties for sand consolidation in subterranean formations
A method of treating a subterranean formation including providing a sugar based hardenable resin, providing proppant particles, providing a hardening agent, combining the sugar based hardenable resin and the hardening agent to form a resin compound, coating the resin compound onto at least a portion of the proppant particles to create resin-coated proppant particles, and placing the coated proppant particles into a subterranean formation zone, wherein the resin compound does not substantially cure prior to placing the resin coated proppant particles into the subterranean formation zone.
Fatty acid polyester derivatives of polyglycosides
Fatty acid polyester derivatives of polyglycosides formed from a polyol having between 2 and 10 hydroxy functions, the 2 hydroxy functions or at least 2 of these hydroxy functions being bound to the anomeric carbon of a reducing carbohydrate that is identical or different for each hydroxy group and selected from the monosaccharides and disaccharides, in which at least one of the other hydroxy groups of the monosaccharide or the disaccharide is esterified by a lipid derivative bearing at least one double bond optionally originating from a vegetable or animal oil, from a mixture of vegetable or animal oils, the double bond or the at least one of the double bonds of the lipid derivative being functionalized by a group selected from the epoxy, amine, alcohol and acid groups, and use thereof in particular in reaction formulations for the production of polymer materials.
MAGNETIC RECORDING MEDIUM, FLUORINE-CONTAINING ETHER COMPOUND AND LUBRICANT FOR MAGNETIC RECORDING MEDIUM
A fluorine-containing ether compound of the present invention is represented by the following General Formula (1). (In the General Formula (1), X is a trivalent atom or a trivalent atom group, A is a linking group including at least one polar group, B is a linking group having a perfluoropolyether chain, and D is a polar group or a substituent having a polar group at the end.)
[Chem. 1]
XA-B-D).sub.3 (1)
Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same
The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.
Thermosetting resin composition, sliding member and method for producing sliding member
A thermosetting resin composition includes an epoxy compound having an isocyanuric acid ring represented by the following formula (1), and a solid lubricant. ##STR00001##