A curable resin composition includes (A) a specific curable resin and (C) a curing agent, and further includes (BI) 0.1 parts by mass or more and 20 parts by mass or less of a polyhydric alcohol having 2 to 5 hydroxyl groups, based on based on 100 parts by mass of the curable resin (A); (BII) a cyclic compound having 3 to 6 reactive groups and a reactive group equivalent of 100 g/eq or more and 300 g/eq or less; or (BIII) a specific oxetane compound in a mass ratio of the curable resin (A) to the oxetane compound (BIII) being 5:5 to 9:1.

A curable resin composition includes (A) a specific curable resin and (C) a curing agent, and further includes (BI) 0.1 parts by mass or more and 20 parts by mass or less of a polyhydric alcohol having 2 to 5 hydroxyl groups, based on based on 100 parts by mass of the curable resin (A); (BII) a cyclic compound having 3 to 6 reactive groups and a reactive group equivalent of 100 g/eq or more and 300 g/eq or less; or (BIII) a specific oxetane compound in a mass ratio of the curable resin (A) to the oxetane compound (BIII) being 5:5 to 9:1.

Provided are [1] a coating composition containing inorganic oxide particles (A), an epoxy compound (b1) having an organosilane moiety, a polyglycerol polyglycidyl ether (b2) having three or more epoxy groups, and a photocationic polymerization initiator (C), [2] a spectacle lens including a hard coat layer obtainable by curing the coating composition described in [1] above and a substrate, and [3] a method for producing a spectacle lens, including a step of applying the coating composition described in [1] above onto a substrate and a step of curing the applied coating composition by irradiation with light.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.

A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II)

##STR00001##

wherein substituents R′ and R″ independently of one another are H or CH.sub.3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula

##STR00002##

where R2=

##STR00003##

methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. Another purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.