An epoxy resin composition is provided which comprises an epoxy resin and a reactive diluent comprising one or more of the monoesters of epoxidized soy oil characterized by a ratio of mols of epoxide groups to mols of ester on the whole of at least 1.35:1. A thermoset plastic composition is also provided which comprises an epoxy resin composition as described, with an amine curing agent.

A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.

The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. % of a) at least one oxetane compound according to Formula (1) below:

##STR00001## wherein: R.sup.1 and R.sup.2 are H, C.sub.1-C.sub.6 alkyl, C.sub.6-C.sub.18 aryl or C.sub.7-C.sub.18 aralkyl; each R.sup.3 is independently a C.sub.1-C.sub.12 alkylene group, C.sub.6-C.sub.18 arylene group, C.sub.2-C.sub.12 alkenylene group or a poly(C.sub.1-C.sub.6 alkyleneoxy) group; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt % of c) at least one ionic photoacid generator; from 0 to 10 wt. % of d) at least one free radical photoinitiator; from 0.01 to 5 wt. % of e) at least one near-infrared absorbing dye; and, from 50 to 90 wt. % of f) particulate filler.

Disclosed is a heat-curable composition including at least one epoxy monomer including two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound (monomer (a)), at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, at least one epoxy ring-opening catalyst and at least one organic solvent selected from glycol monoethers. The composition includes less than 10% by weight of monomers (a) and provides upon curing a coating having improved hardness properties.

Disclosed is a heat-curable composition including at least one epoxy monomer including two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound (monomer (a)), at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, at least one epoxy ring-opening catalyst and at least one organic solvent selected from glycol monoethers. The composition includes less than 10% by weight of monomers (a) and provides upon curing a coating having improved hardness properties.

An example nanoimprint lithography (NIL) resin composition includes a total of three monomers, wherein two of the three monomers are selected from the group consisting of two different epoxy substituted silsesquioxane monomers; two different epoxy substituted cyclosiloxane monomers; and two different non-organosilicon epoxy monomers. A third of the three monomers is a fluorinated monomer that is present in an amount ranging from about from 0.5 mass % to about 4 mass %, based on a total solids content of the NIL resin composition. The NIL resin also includes a photoinitiator and a solvent.

An example nanoimprint lithography (NIL) resin composition includes a total of three monomers, wherein two of the three monomers are selected from the group consisting of two different epoxy substituted silsesquioxane monomers; two different epoxy substituted cyclosiloxane monomers; and two different non-organosilicon epoxy monomers. A third of the three monomers is a fluorinated monomer that is present in an amount ranging from about from 0.5 mass % to about 4 mass %, based on a total solids content of the NIL resin composition. The NIL resin also includes a photoinitiator and a solvent.

A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.

The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5 C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.

The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5 C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.