The present invention provides: a curable composition including an epoxy resin, an amine compound, and core-shell particles, in which the amine compound contains an N-(aminoalkyl)piperazine compound as an essential component; a cured product thereof; a fiber reinforced composite material, a fiber reinforced resin molded article, and a method for producing a fiber reinforced resin molded article. The curable resin composition has fast curability, also has favorable impregnation property into reinforced fibers, and furthermore, can form a cured product having excellent toughness and the like.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

A thermosetting resin composition at least including: [A] an epoxy resin containing two or more glycidyl groups; [B] a cyanate ester resin containing two or more cyanate groups; and [C] an amine compound; and satisfying the following conditions (1) and (2): (1) 0.25≤the number of moles of glycidyl groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition≤1.5; and (2) 0.05≤the number of moles of active hydrogen contained in the amino groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition<0.5; and a prepreg and a fiber reinforced composite material using the thermosetting resin composition. Provided are a thermosetting resin composition having excellent mechanical properties and heat resistance in a high-temperature environment after moisture absorption, and having excellent reactivity that allows curing in a short time; a prepreg prepared by impregnating a reinforced fiber with a thermosetting resin composition, which prepreg has excellent handling ability (tackiness properties) at room temperature; and a fiber reinforced composite material including a thermosetting resin composition and a reinforced fiber.

A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ≤45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.

According to one embodiment of the present disclosure, an electroconductive resin composition achieves both storage stability and a low connection resistance value of the cured product. An electroconductive resin composition contains the following components (A) to (E), component (A): an epoxy resin having two or more epoxy groups in one molecule, component (B): a reactive diluting agent having one epoxy group in one molecule, component (C): rubber particles, component (D): electroconductive particles containing the following (d-1) and (d-2), (d-1): plate-shaped silver particles, (d-2): electroconductive particles other than plate-shaped silver particles, and component (E): an epoxy curing agent. An organic solvent content is 1% by mass or less with respect to the entire electroconductive resin composition.

A curing agent composition based on diaminomethylcyclohexane and 1,3-cyclohexanebis(methylamine) can be used in an epoxy resin composition for chemical fastening of structural elements. A corresponding epoxy resin composition and multi-component epoxy resin system can contain the curing agent composition. A method can be used for chemical fastening of structural elements in boreholes with the epoxy resin composition or the multi-component epoxy resin system.