An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b). In the formula, R represents an s-valent straight-chain or branched saturated aliphatic hydrocarbon group or an s-valent group having two or more straight-chain or branched saturated aliphatic hydrocarbon groups bonded to each other through an ether bond, and s represents an integer of 2 or greater.

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

An improved photoimageable dry film formulation, a fluidic ejection head containing a thick film layer derived from the improved photoimageable dry film formulation, and a method for making a fluidic ejection head. The improved photoimageable dry film formulation includes a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying.

Superhydrophobic electrothermal epoxy composites, their preparation and a self-healing method are disclosed. 1,4,5-oxadithiepane-2,7-dione and methylhexahydrophthalic anhydride were mixed and cured with epoxides to get self-healable epoxy resins; carbon nanotube/self-healable epoxy resin prepolymers were coated on self-healable epoxy resins and cured to get electrothermal epoxy composites; modified superhydrophobic copper powders were adhered on electrothermal epoxy composites and cured to get a kind of superhydrophobic electrothermal epoxy composites. The thermal resistance of superhydrophobic electrothermal epoxy composites is superior to existed technical solutions and they can simultaneously repair cracking and delamination and the healed samples still exhibit excellent superhydrophobicity. These merits of superhydrophobic electrothermal epoxy composites provided in this invention can meet the harsh requirements of self-healing and removing ice on surfaces of wind turbine blades, suggesting good abilities of guaranteeing service safety and lifespan of wind turbine blades.

Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R.sub.1—(Y.sup.1)n), wherein R.sub.1 is an ionic moiety, Y.sup.1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (R.sub.2—Z.sup.1)n), wherein R.sub.2 is an ionic moiety, Z.sup.1 comprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.

There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature. The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.

A photopolymer composition comprising at least one cycloaliphatic epoxy compound and a photoinitiator comprising a triarylsulfonium salt.

The present invention provides compositions, methods and kits for the temporal control induction time for a polymerization reaction.

Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity (weight-average molecular weight to number-average molecular weight ratio) of 1.0 to 3.0.

[R.sup.1SiO.sub.3/2]  (1)

[Chem. 2]

[R.sup.aSiO.sub.3/2]  (I)

[Chem. 3]

[R.sup.bSiO(OR.sup.c)]  (II)

[Chem. 4]

[R.sup.1SiO(OR.sup.c)]  (4)