Patent classifications
C08G59/4071
Esterified acids for use in polymeric materials
The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.
TWO-PACK EPOXY RESIN COMPOSITON FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL
A two-pack epoxy resin composition for a fiber-reinforced composite material contains components [A] to [E], in which the content of the component [A] is 5 to 45 parts by mass, the content of the component [B] is 5 to 50 parts by mass, and the content of the component [C] is 5 to 50 parts by mass, relative to 100 parts by mass of the total of the components [A], [B] and [C], and the fiber-reinforced composite material, component [A]: an alicyclic epoxy resin component [B]: an aliphatic epoxy resin component [C]: a bisphenol type epoxy resin component [D]: an acid anhydride component [E]: a compound selected from the group consisting of quaternary ammonium salts, quaternary phosphonium salts, and imidazolium salts.
CERAMIC RESIN COMPOSITE BODY
Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180 C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.
LOW DK PHOSPHOROUS CONTAINING HARDENER USEFUL FOR HALOGEN FREE, FLAME RETARDANT POLYMERS AND USE
A Formula of a phosphorous fire-retardant hardener having fire-retardant and heat-resistant properties as well as a low-dielectric constant. With a preparation of glass-fiber laminated board, the hardener meets UL-94V fire-retardant requirements and has a dielectric constant 5 of 4.0 (1 GHz).
EPOXY RESIN SYSTEMS
Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
DCPD-DERIVED POLYETHER AND METHOD OF PRODUCING THE SAME
A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.
FLAME-RETARDANT, HIGH TEMPERATURE RESISTANT THERMOSETS ON THE BASIS OF NAPHTHALENE-BASED EPOXY RESINS AND CYANATE ESTERS
The embodiments relate to a polymerisable thermoset composition having improved flame retardant properties, a polymerised thermoset having improved flame retardant properties, a process for manufacturing the polymerised thermoset, and use of the polymerisable thermoset composition to produce lightweight construction components, preferably carbon fibre composites (CFRP), and a lightweight construction component, preferably carbon fibre composite (CFRP), containing the polymerised thermoset.
Esterified Acids for Use in Polymeric Materials
The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.
ACTIVE ESTER CURING AGENT COMPOUND FOR THERMOSETTING RESINS, FLAME RETARDANT COMPOSITION COMPRISING SAME, AND ARTICLES MADE THEREFROM
There is provided herein a flame retardant and curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.
Flame-retardant, high temperature resistant thermosets on the basis of naphthalene-based epoxy resins and cyanate esters
The embodiments relate to a polymerizable thermoset composition having improved flame retardant properties, a polymerized thermoset having improved flame retardant properties, a process for manufacturing the polymerized thermoset, and use of the polymerizable thermoset composition to produce lightweight construction components, preferably carbon fiber composites (CFRP), and a lightweight construction component, preferably carbon fiber composite (CFRP), containing the polymerized thermoset.