C08G59/4078

Curable composition, cured product, cured film, display panel, and method for producing cured product

A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.

Low temperature curing composition, cured film formed therefrom, and electronic device having cured film

Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises: (A) an epoxy group-containing siloxane compound represented by Chemical Formula 1:
(R.sup.1R.sup.2R.sup.3SiO.sub.1/2).sub.M(R.sup.4R.sup.5SiO.sub.2/2).sub.D1(R.sup.6SiO.sub.3/2).sub.T1(R.sup.7R.sup.8SiO.sub.2/2).sub.D2(R.sup.9SiO.sub.3/2).sub.T2[Chemical Formula 1]
(In Chemical Formula 1, each of R.sup.1 to R.sup.9 is an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0M<1, 0D1<1, 0<T1, 0D2<1, 0T2<1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different structural units); and (B) a cationic thermal initiator for a ring-opening reaction of epoxide, the initiator being a salt of a sulfonium-based cation and a borate-based anion, wherein the compound represented by chemical formula 1 is a combination of a siloxane 1,000 and a siloxane compound of which a number average molecular weight is in a range of 1,000-10,000.

IMPREGNATION RESIN MIXTURE
20200270446 · 2020-08-27 ·

The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidised halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.

EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg.

The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014(content of component [D]/content of component [C])0.045, [b]: 0.9(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])1.2, and [c]: 14(content of component [A]/content of component [C])25.

Carrier Nanoparticles And Related Compositions, Methods And Systems
20190314520 · 2019-10-17 ·

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

Carrier nanoparticles and related compositions, methods and systems

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

Epoxy resin composition

An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.

CURABLE COMPOSITION, CURED FILM, DISPLAY PANEL OR OLED LIGHT, AND METHOD FOR PRODUCING CURED PRODUCT
20190031818 · 2019-01-31 ·

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.

Carrier Nanoparticles And Related Compositions, Methods And Systems
20190000990 · 2019-01-03 ·

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

Carrier nanoparticles and related compositions, methods and systems

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.