A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.

An aspect of the present invention relates to a resin composition for optical waveguide containing an epoxy resin and a curing agent, in which the number of aliphatic CH groups in the epoxy resin per unit volume is 0.055? Avogadro's number (N.sub.A) (/cm.sup.3) or less in the resin composition for optical waveguide.

A reversible epoxy polymer obtainable by the reaction between at least one epoxy compound and at least one curing agent, wherein at least part of the epoxy compound contains one reversible borate moiety or derivative thereof per molecule; and/or at least part of the curing agent contains one reversible borate moiety or derivative thereof per molecule; and/or the reaction system further comprises at least one compound containing hydroxyl and epoxy group and at least one BQH-containing compound or its ester derivative, wherein said BQH-containing compound contains two or more B-QH moieties, and wherein the derivative of borate moiety represents a moiety with the oxygen in the borate moiety being replaced with other element of the sixth main group and wherein each Q is independently an element of the sixth main group.

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises:

(A) an epoxy group-containing siloxane compound represented by Chemical Formula 1:

(R.sup.1R.sup.2R.sup.3SiO.sub.1/2).sub.M(R.sup.4R.sup.5SiO.sub.2/2).sub.D1(R.sup.6SiO.sub.3/2).sub.T1(R.sup.7R.sup.8SiO.sub.2/2).sub.D2(R.sup.9SiO.sub.3/2).sub.T2 [Chemical Formula 1]

(In Chemical Formula 1, each of R.sup.1 to R.sup.9 is an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0M<1, 0D1<1, 0<T1, 0D2<1, 0T2<1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different structural units); and

(B) a cationic thermal initiator for a ring-opening reaction of epoxide, the initiator being a salt of a sulfonium-based cation and a borate-based anion, wherein the compound represented by chemical formula 1 is a combination of a siloxane 1,000 and a siloxane compound of which a number average molecular weight is in a range of 1,000-10,000.

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

Carrier nanoparticles comprising a polymer containing a polyol coupled to a polymer containing a boronic acid and a linkage cleavable under reducing conditions, configured to present the polymer containing a boronic acid to an environment external to the nanoparticle and related compositions, methods and systems.

The purpose of the present invention is to provide an epoxy resin composition which exhibits a high level of deforming capacity and fracture toughness and from which a resin cured product maintaining heat resistance can be obtained. The epoxy resin composition according to the present invention satisfies condition 1 or condition 2 below, wherein the resin cured product obtained by reacting the epoxy resin composition at 150 C. for 60 minutes has a tensile elongation at break of 7% or more. Condition 1: including all the following components [A], [B], and [C], component [A]: a bifunctional aliphatic epoxy resin having a specific structure, component [B]: a terminal carboxy-modified acrylic rubber, and component [C]: a dicyandiamide. Condition 2: including the following components [D], [E], and [F] and satisfying conditions [a] and [b] below, component [D]: core-shell type rubber particles, component [E]: a boric ester compound, component [F]: a curing agent, condition [a]: including 9-18 parts by mass of component [D] with respect to 100 parts by mass of the total epoxy resin, and condition [b]: 0.003(the content of component [E]/the content of component [D])0.05.

The present invention relates to an electrically conductive composition comprising a) from 5 to 25% by weight of the total weight of the composition of a cycloaliphatic epoxide resin; b) from 0.05 to 10% by weight of the total weight of the composition of a vinyl ether; c) from 0.1 to 0.45% by weight of the total weight of the composition of an onium salt; d) from 0.01 to 10% by weight of the total weight of the composition of a radical initiator; e) from 45 to 85% by weight of the total weight of the composition of electrically conductive particles; and f) from 0.1 to 10% by weight of the total weight of the composition of an organic solvent. The composition can be used as an adhesive in the electronic applications, especially as an adhesive in the shingle module photovoltaic applications.