The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

The invention relates to a process for free radical-induced cationic frontal polymerization of cationically polymerizable monomers using a combination of at least one cationic polymerization initiator and at least one activator for said at least one initiator, characterized in that benzopinacol is used as said activator.

A preparation method of thermadapt shape memory polymers includes: (1) synthesis of pendant hydroxyl groups functionalized epoxy oligomer using epoxy resin and alcohol amine; (2) synthesis of alkoxyl groups terminated silane crosslinking agent by isocyanate silane coupling agent and diamine; (3) crosslinked shape memory polymers were prepared by condensation reaction of pendant hydroxyl groups functionalized epoxy oligomer and alkoxyl groups terminated silane crosslinking agent. The thermadapt shape memory polymers show high glass transition temperatures and high tensile strength. The original shape of thermadapt shape memory polymers can be reconfigured to a new permanent shape as needed, and thus effectively solving the bottleneck problems of reprocessing or reshape in the traditional crosslinked polymers once after molding. The thermadapt shape memory polymers are suitable for smart materials based on shape memory polymers with complex three-dimensional permanent shapes, and showing unfolding or folding behaviors along with convert to three-dimensional structures under heat stimulation.

A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Provided is a curable composition which can form, when cured, a cured product having high surface hardness and offering excellent flexibility and workability. The curable composition according to the present invention contains a cationically curable silicone resin, an epoxy compound other than the cationically curable silicone resin, and a leveling agent. The cationically curable silicone resin includes silsesquioxane units. The cationically curable silicone resin includes epoxy-containing constitutional units in a proportion of 50 mole percent or more of the totality of constitutional units in the cationically curable silicone resin. The cationically curable silicone resin has a number-average molecular weight of 1000 to 3000.

A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature.

An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23 C. and 50% RH (ASTM D4287); and wherein the ratio between hydrogen equivalents in the curing agent and epoxy equivalents of the coating composition is in the range 50:100 to 120:100.

The present invention relates to a curable two-part resin system having a resin part containing at least one cycloaliphatic epoxy resin and a hardener part containing (i) at least one alicyclic anhydride, and (ii) a block-copolymer having polysiloxane blocks and organic blocks, and containing greater than 60 wt % of an inorganic filler.