One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.

The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.

A method for producing a bisphenol or the like by using a chemical recycling method that is moderate, has a small environmental load, and can efficiently degrade a polycarbonate resin is provided. In addition, a method for producing a recycled polycarbonate resin or the like by using a useful substance such as the bisphenol or the like is provided. A method for producing a bisphenol, including degrading a polycarbonate resin in the presence of an aromatic monoalcohol, water, and a catalyst. A method for producing carbon dioxide, including recovering carbon dioxide generated by the method for producing a bisphenol. A method for producing a carbonic acid diester by using the carbon dioxide. A method for producing a recycled polycarbonate resin by using the bisphenol and/or the carbonic acid diester. A method for producing an epoxy resin and a method for producing an epoxy resin cured product, by using the bisphenol

There is provided an epoxy composition which has difficulty in precipitating a crystal during storage, is homogeneous and can be stored for a long period; and a cured product of the composition having excellent transparency, heat resistance, and light resistance can be obtained on curing. An α-type tris-(2,3-epoxypropyl)-isocyanurate crystal including β-type tris-(2,3-epoxypropyl)-isocyanurate in the crystal in a ratio of 2% by mass to 15% by mass. A method for producing the α-type tris-(2,3-epoxypropyl)-isocyanurate crystal including step (i) separating β-type tris-(2,3-epoxypropyl)-isocyanurate contained in a tris-(2,3-epoxypropyl)-isocyanurate solution from the solution as a solid to obtain a crystal with an increased content ratio of α-type tris-(2,3-epoxypropyl)-isocyanurate.

The present invention provides an electrodeposition-coated article production method which is suitable for producing an electrodeposition-coated article comprising a carbon fiber-reinforced plastic. An electrodeposition-coated article production method according to the present invention includes: a molding step of obtaining a carbon fiber-reinforced plastic molded article by curing a prepreg comprising a carbon fiber reinforcement and a thickened product of an epoxy resin composition in which a bisphenol A epoxy resin, [4-(glycidyloxy)phenyl]diglycidylamine and a curing agent component are mixed; and an electrodeposition coating step of coating the carbon fiber-reinforced plastic molded article by electrodeposition. The epoxy resin composition, when cured at 140° C., gives a cured resin which has a glass transition temperature G′-Tg of more than 100° C. and less than 200° C. and in which a dynamic storage elastic modulus G′ value at 200° C. is more than or equal to 8% of the value at 100° C.

A composition containing: a compound represented by the following formula (D):

##STR00001##

wherein m is an integer of 0 to 6; p is 0 or 1; q is an integer of 0 to 6; Rf is a C1-C8 perfluoroalkyl group optionally containing oxygen with one fluorine atom being optionally replaced by a hydrogen atom, and a compound represented by the following formula (E):

##STR00002##

wherein n is an integer of 0 or greater; and M is a group represented by the following formula (E1):

##STR00003##

a group represented by the following formula (E2):

##STR00004##

or a group represented by the following formula (E3):

##STR00005##

wherein Z is hydrogen or a C1-C10 fluoroalkyl group.

Various embodiments include an impregnation formulation for a wrapping tape insulation of an electrical machine. The formulation comprises: a resin formulation with an epoxy base resin and a first component; and a hardener formulation with a hardener. The resin formulation reacts when combined with the hardener formulation to produce an insulation material. The first component includes a saturated and/or unsaturated epoxycycloalkyl group. A glass transition temperature of the insulation material is elevated compared to an impregnation formulation without the first component.