To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

A compound having end groups each having a reactive group that are disposed at both ends respectively, and between the end groups, either or both of a first structure in which an aromatic cyclic group, an ether oxygen, a methylene group, an aromatic cyclic group, a methylene group, an ether oxygen and an aromatic cyclic group are bonded together in this order and a second structure in which an aromatic cyclic group, a methylene group, an ether oxygen, an aromatic cyclic group, an ether oxygen, a methylene group and an aromatic cyclic group are bonded together in this order.

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

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By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

Compounds including two or more aromatic rings to which a fluorine-substituted arylcarbonyloxy group is directly bonded are useful as epoxy resin curing agents.

The present invention provides: a two-pack curable epoxy resin composition that contains a curing agent having excellent long-term storage stability, has a low viscosity and a good impregnation property into fibers; the cured product; a fiber-reinforced composite material; and a molded article. Specifically, the two-pack curable epoxy resin composition is used, the two-pack curable epoxy resin composition containing: a main agent (i) containing an epoxy resin (A); and a curing agent (ii) containing an acid anhydride (B) and an organic phosphorus compound (C), in which a mass ratio [(i)/(ii)] of the main agent (i) to the curing agent (ii) is in a range of 35/65 to 75/25, and an amount of the organic phosphorus compound (C) used is in a range of 0.5 to 5 parts by mass with respect to 100 parts by mass in total of the epoxy resin (A) and the acid anhydride (B).

A powder coating material used for a powder coating method including a step of immersing a coil end of a coil, which includes a conductor portion coated with an insulating coating and an exposed portion where the conductor portion is exposed from the insulating coating, in a fluidized chamber in which a powder coating material flows, and adhering a melt of the powder coating material to an outside of the exposed portion, the powder coating material containing a particulate thermosetting resin composition. The thermosetting resin composition contains an epoxy resin, and a curing agent.