One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. Another purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): ##STR00001##
wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): ##STR00002##
wherein Y is a bond, a C.sub.1-6 alkylene group, etc.; R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc., R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc., R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

An epoxy resin composition in a liquid or solid state having excellent solubility and having high preservation stability. A modified epoxy resin composition including: Compound A containing tris-(2,3-epoxypropyl)-isocyanurate having 1 to 3 glycidyl group(s) in a molecule substituted with a functional group(s) of Formula (1): ##STR00001##
in which R.sup.1 and R.sup.2 are each independently an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group; or a halogenated derivative, an aminated derivative, or a nitrated derivative of these groups; and Compound B containing tris-(2,3-epoxypropyl)-isocyanurate, wherein tris-(2,3-epoxypropyl)-isocyanurate of Compound A before the substitution and tris-(2,3-epoxypropyl)-isocyanurate of Compound B comprise 2% by mass to 15% by mass of -type tris-(2,3-epoxypropyl)-isocyanurate and a remaining percentage of -type tris-(2,3-epoxypropyl)-isocyanurate based on a total mass of Compound A before the substitution and Compound B.

A first object of the present invention is to provide a composition capable of forming a cured product (thermally conductive material) having excellent thermal conductivity. In addition, a second object of the present invention is to provide a thermally conductive material formed from the composition and a device with a thermally conductive layer. In addition, a third object of the present invention is to provide a method for manufacturing a thermally conductive material using the composition.

The composition of the present invention includes a curing agent including an active hydrogen-containing functional group, and a main agent including a reactive group which reacts with the active hydrogen-containing functional group, in which the main agent and the curing agent respectively exhibit liquid crystallinity in a single state at a temperature of 150 C. or lower.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1):

##STR00001##

wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2):

##STR00002##

wherein Y is a bond, a C.sub.1-6 alkylene group, etc.;

R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc.,

R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc.,

R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and

n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

A hardener composition for epoxy resins includes a dianhydride and one or both of a monoanhydride and a hydroxyl-diterminated poly(phenylene ether). The hardener components can be blended in the substantial absence of solvent to yield a homogeneous composition having a reduced glass transition temperature or melting point that facilitates reduced-temperature blending of the hardener composition with the epoxy resin.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. Another purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95 C. or higher.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95 C. or higher.

Cured products that are formed of a cured material obtained by curing a resin composition including (A) at least one epoxy resin, (B) at least one curing agent, and (C) at least one inorganic filler, and have a ground surface, in which the maximum depth of a depressed portion present on the ground surface is less than 10 m are useful for making printed wiring boards.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener or an acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95 C. or higher.