This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

Provided are methods, polymer-containing formulations, and polymer compositions for treating retinal detachment and other ocular disorders, where the methods employ polymer compositions or polymer-containing formulations that can form a hydrogel in the eye of a subject. In certain embodiments, the hydrogel is formed by reaction of (a) a nucleo-functional polymer is a biocompatible polyalkylene polymer substituted by (i) a plurality of OH groups, (ii) a plurality of thio-functional groups R.sup.1SH wherein R.sup.1 is an ester-containing linker, and (iii) optionally one or more OC(O)(C.sub.1-C.sub.6 alkyl) groups, such as a thiolated poly(vinyl alcohol) polymer and (ii) an electro-functional polymer that is a biocompatible polymer containing at least one thiol-reactive group, such as a poly(ethylene glycol) polymer containing alpha-beta unsaturated ester groups. In certain embodiments, the hydrogel is formed by curing a biocompatible polymer described herein, such as a thermosensitive polymer, nucleo-functional polymer, electro-functional polymer, or pH-sensitive polymer.

The invention provides an epoxy compound A represented by the following formula (1):

##STR00001## in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R.sub.3 to R.sub.8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R.sub.3 to R.sub.8 is a glycidyl ether group or a 2-methylglycidyl ether group; R.sub.9 to R.sub.12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p.sub.1, p.sub.2, and q are average values of repetition, m is 0.5 to 10, p.sub.1 and p.sub.2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

The invention provides an epoxy compound A represented by the following formula (1):

##STR00001## in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R.sub.3 to R.sub.8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R.sub.3 to R.sub.8 is a glycidyl ether group or a 2-methylglycidyl ether group; R.sub.9 to R.sub.12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p.sub.1, p.sub.2, and q are average values of repetition, m is 0.5 to 10, p.sub.1 and p.sub.2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.

An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1):

##STR00001##

(wherein R.sup.1 and R.sup.2 are each independently H, CH.sub.3, OCH.sub.3, 0C.sub.2H.sub.5, NO.sub.2, halogen, or NHCO NR.sup.3R.sup.4; and R.sup.3 and R.sup.4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R.sup.3 and R.sup.4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1):

##STR00001##

(wherein R.sup.1 and R.sup.2 are each independently H, CH.sub.3, OCH.sub.3, 0C.sub.2H.sub.5, NO.sub.2, halogen, or NHCO NR.sup.3R.sup.4; and R.sup.3 and R.sup.4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R.sup.3 and R.sup.4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

A novel sulfanilamide containing epoxy resin composition capable of fast curing without negative impact on glass transition temperature or mechanical performance.

A novel sulfanilamide containing epoxy resin composition capable of fast curing without negative impact on glass transition temperature or mechanical performance.