Patent classifications
C08G59/5006
Blend for curing epoxy resin composistions
The present disclosure provides a curable composition that includes an epoxy resin and a curing component comprising a blend of at least two amines. The curable composition may be combined with reinforced fibers and cured to form a composite article which can be used in various applications, such as in wind turbine blades.
Improved Structural Bonding Adhesive
A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.
STRUCTURAL ADHESIVE COMPOSITIONS
Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.
CURABLE COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
The present invention provides: a curable composition including an epoxy resin, an amine compound, and core-shell particles, in which the amine compound contains an N-(aminoalkyl)piperazine compound as an essential component; a cured product thereof; a fiber reinforced composite material, a fiber reinforced resin molded article, and a method for producing a fiber reinforced resin molded article. The curable resin composition has fast curability, also has favorable impregnation property into reinforced fibers, and furthermore, can form a cured product having excellent toughness and the like.
GLYCEROL-BASED EPOXY RESINS
An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component. A cured aliphatic epoxy resin containing a precursor composition and a curing component, the precursor composition including an epoxy component and, optionally, a reactive component, and the cured resin containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component.
Use of salts as accelerators in an epoxy resin compound for chemical fastening
A method involves using at least one salt (S) selected from the salts of nitric acid, salts of nitrous acid, salts of halogens, or salts of trifluoromethanesulfonic acid, as an accelerator in a multi-component epoxy resin compound for the chemical fastening of construction elements and/or anchoring elements. Another method involves the chemical fastening of construction elements and anchoring elements, such as anchor rods, anchor bolts, rods, sleeves, reinforcing bars, screws, and the like in boreholes in various substrates.
DIELECTRIC PROPERTY-LOWERING AGENT, LOW-DIELECTRIC RESIN COMPOSITION CONTAINING SAME AND METHOD FOR LOWERING DIELECTRIC PROPERTIES OF RESIN
A dielectric property-lowering agent is composed of a specific epoxy-modified silicone resin having a low relative permittivity and a low dielectric loss tangent, and has an ionic species content of less than 0.001 wt %.
Epoxy resin system for structural composites
A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa.Math.s at 25° C.
EPOXY RESIN-BASED FIBRE MATRIX COMPOSITIONS CONTAINING ALKYL-SUBSTITUTED ETHYLENE AMINES
Epoxy resin-based fibre matrix compositions contain alkyl substituted ethylene amines such as dimethyldiethylenetriamine (DMDETA, also dimethyl-1,4,7-triazaheptane), as a curing agent. These curing agents are characterized by a short curing time for a comparatively long processing time, and make it possible to obtain cured epoxy resins that exhibit low brittleness and high tensile strength and have a high glass transition temperature; as a result of which the fibre matrix composition is suitable particularly for use in pultrusion and winding processes.
CURABLE COMPOSITION
A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by —SiR.sup.5.sub.cX.sub.3-c. R.sup.5 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer(B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2).