Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1);
H.sub.2N—CH.sub.2-A-CH.sub.2—NH.sub.2  (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa.Math.s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa.Math.s or less.

An amino-functional addition product from the reaction of at least one diamine of the formula (I) with at least one aromatic diepoxide in a stoichiometric ratio in the range of 1.3 to 1.7 mole diamine per 1 mole-equivalent of epoxy groups. The addition product is liquid at room temperature without a diluent and has surprisingly low viscosity. The composition allows the manufacture of low-emission epoxy-resin coatings that have good workability, cure particularly rapidly and with high surface quality in cold and damp conditions, and allow for a wide range of combinations with other amines and diluents.

The present disclosure provides a curable resin composition including a thermoset resin, a toughener component containing a multistage polymer and a thermoplastic toughener and a hardener. The curable resin composition may be combined with reinforcing fibers and then cured to form a fiber-reinforced composite article having a high glass transition temperature and excellent mechanical properties. The fiber-reinforced composite article may be used in various applications, such as in transport applications including aerospace, aeronautical, nautical and land vehicles.

The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.

A curing agent composition based on diaminomethylcyclohexane and 1,3-cyclohexanebis(methylamine) can be used in an epoxy resin composition for chemical fastening of structural elements. A corresponding epoxy resin composition and multi-component epoxy resin system can contain the curing agent composition. A method can be used for chemical fastening of structural elements in boreholes with the epoxy resin composition or the multi-component epoxy resin system.

The present invention relates to an epoxy resin system containing an epoxy resin and a mono-alkylated diamine. The epoxy resin system can further contain a second amine. The present invention also relates to a method for producing an epoxy resin system comprising combining an epoxy resin with a mono-alkylated diamine. The mono-alkylated diamines of this invention enhance desirable processing and cured properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with cycloaliphatic amine-based curing agents.

An amine-functional adduct from the reaction of an amine mixture containing at least one diamine of formula (I) and at least one diamine of formula (II) in a weight ratio ranging from 65/35 to 95/5 with at least one diepoxide in a stoichiometric ratio of at least 1. 2 moles of diamine of the formula (I) to 1 mole equivalent of epoxide groups. The adduct is liquid at room temperature without diluent even in the presence of a small excess of diamine and is surprisingly low in viscosity. In addition, it is particularly cost-effective, as it is available from an amine mixture that is technically easy to produce. The adduct enables low-emission or emission-free epoxy resin coatings with surprisingly good workability at surprisingly fast curing, which have a high hardness and low tendency to yellowing, and which hardly tend to blushing-related defects even in cold and humid conditions.

The present invention is directed to compositions comprising a first component, a second component, and elastomeric particles. The first component comprises an epoxy-containing compound. The second component comprises a diamine comprising a cyclic ring and/or a polyamine comprising a cyclic ring. The diamine may chemically react with the epoxy-containing compound. Optionally, the cyclic ring of the diamine and/or the polyamine has at least one carbon positioned between the amino functional groups and the cyclic ring structure. Optionally, at least 50% by weight of the elastomeric particles comprise a styrene butadiene core based on total weight of the elastomeric particles. The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.

The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.