Described is a curable composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; a compatibilizer having at least one silane group and at least one epoxy terminal group or at least one nitrogen-containing groups; and optionally a hardening agent; wherein the composition further optionally comprises at least one of a nitrogen-containing unsaturated heterocyclic compound catalyst and a nitrogen-containing phenol catalyst. The curable composition exhibits high hermeticity, fast curing speed, quick adhesion build up, dry surface and strong adhesion strength. A method for applying the curable composition on the surface of a substrate is also provided.

The invention relates to diols derived from 5-hydroxymethyl furfural, diformyl furan, or derivatives thereof. The invention further relates to diglycidyl ethers derived from the diols of the invention, curable coating compositions containing the diglycidyl ethers, and objects coated with the curable coating compositions. The invention also relates to composites, composites, adhesives, and films containing the diglycidyl ethers of the invention. The invention also relates to methods of making the diols, diglycidyl ethers, and curable coating compositions.

A thermosetting resin composition contains at least: [A] a thermosetting resin; [B] a curing agent; and [C] polyamide particles satisfying following (c1) to (c6): (c1) a melting point of polyamide resin constituting the polyamide particles is 200 to 300° C.; (c2) a crystallization temperature of the polyamide resin constituting the polyamide particles is 150° C. to 250° C.; (c3) a number average particle size of the polyamide particles is 1 to 100 μm; (c4) a sphericity of the polyamide particles is 80 to 100; and (c5) the linseed oil absorption of the polyamide particles is 10 to 100 mL/100 g. A thermosetting resin composition of the present invention enables suitable production of a fiber-reinforced composite material having sufficient compressive strength after impact and wet heat compression performance.

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):

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wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15° C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1);
H.sub.2N—CH.sub.2-A-CH.sub.2—NH.sub.2  (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa.Math.s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa.Math.s or less.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of −60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).