The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Disclosed are epoxy resins exhibiting a highly favorable combination of tensile strength and elongation with respect to prior art epoxy systems. The elastomeric epoxy resin systems of the invention are prepared utilizing a curing agent containing at least one monoprimary amine, and are particularly useful in applications such as, for example, castings, potting, composites, crack sealing, coatings, adhesives, roofing materials, flooring or reinforced membranes.

It is to provide an epoxy resin comprising a phenol compound having a curing acceleration effect even when a low reactive curing agent is used, and allowing the amount of the curing agent used to be reduced. Here is used an epoxy resin composition comprising a glycidylamine-type epoxy resin, an aromatic polyamine and 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane. The aromatic polyamine and 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane optionally form a clathrate compound.

An epoxy resin composition for a fiber-reinforced composite material includes: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound, blended in specific ranges.

Provided are a fiber-reinforced composite material excellent in heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Further provided are a fiber-reinforced composite material having less volatile matters during the curing time, and having excellent heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Provided are: an epoxy resin composition for a fiber-reinforced composite material, comprising an amine type epoxy resin [A], an aromatic amine curing agent [B], and a block copolymer [C] having a reactive group capable of reacting with an epoxy resin; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. Further provided are: an epoxy resin composition comprising an epoxy resin [A] having two or more of four- or more-membered ring structures, and having either one of a glycidyl amino group directly bonded to the ring structure or a glycidyl ether group directly bonded to the ring structure, epoxy resin [B] having three or more of functional groups, a curing agent [C], and an elastomer component [D]; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg.

This document relates to epoxy compositions containing a sliding-ring polymer (polyrotaxane) additive and a thermally-curable epoxy resin. The epoxy compositions exhibit increased flexural toughness and impact resistance as compared to the same epoxy composition that does not contain the additive. This document also relates to 3D-printed epoxy compositions containing a sliding-ring polymer (polyrotaxane) additive and a thermally-curable epoxy resin.

The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.

Implementations described herein relate to an etheramine mixture containing a cyclobutane based amine and its method of production by alkoxylating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the ehteramine mixture. The etheramine mixture may be used in a variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea materials.

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

A prepreg having at least one layer of carbon fibres and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibres, wherein the curable thermosetting resin system includes: a curable thermosetting resin including at least one epoxide group, the curable thermosetting resin having an epoxy equivalent weight of from 140 to 180 g/eq; a curing agent for curing the curable thermosetting resin, wherein the curing agent is present in the liquid phase and includes a cyanamide reactive group; and a rheology modifier for the curable thermosetting resin system, wherein the rheology modifier includes at least one of a thermoplastic resin and an inorganic particulate thickener or a mixture thereof.