A two-part thermally conductive curable composition exhibits high dispensing rates and cures to a thermally conductive interface material with high thermal reliability, including high fracture toughness and elongation properties. The curable composition employs a combination of multi-functional and mono-functional liquid epoxy resins with low viscosity.

A two-part thermally conductive curable composition exhibits high dispensing rates and cures to a thermally conductive interface material with high thermal reliability, including high fracture toughness and elongation properties. The curable composition employs a combination of multi-functional and mono-functional liquid epoxy resins with low viscosity.

An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a CO.sub.2 transmission prevention method.