Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1);
H.sub.2N—CH.sub.2-A-CH.sub.2—NH.sub.2  (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

The invention relates to a low density two-component structural void filling composition that is preferably based on epoxy chemistry. It is designed for use on interior honeycomb sandwich structures as edge close-out and corner reinforcement, as well as local reinforcement for mechanical fixation or complex gap filling. The composition is compatible with metal and non-metal constructions that are typically found in aircraft interiors. The cured material has excellent fire, smoke and toxicity properties. Further, the composition has excellent processing attributes due to easy storage, handling, extrudability, filling, grinding, and painting abilities.

The invention relates to a low density two-component structural void filling composition that is preferably based on epoxy chemistry. It is designed for use on interior honeycomb sandwich structures as edge close-out and corner reinforcement, as well as local reinforcement for mechanical fixation or complex gap filling. The composition is compatible with metal and non-metal constructions that are typically found in aircraft interiors. The cured material has excellent fire, smoke and toxicity properties. Further, the composition has excellent processing attributes due to easy storage, handling, extrudability, filling, grinding, and painting abilities.

The disclosure relates to epoxy-based compositions comprising a decarboxylated rosin acid (DCR) component, suitable as an efficient plasticizer. It further improves hardness, elasticity, UV exposure viability properties of the paint and coating compositions. The DCR increases the bio-based renewable material content of a coating formulation and provide solutions for phthalate-free products. The DCR has a density of 0.9 to 1.0 g/cm.sup.3, a flash point of 135 to 175° C., an acid value of < 50 mg KOH/g, measured according to ASTM D465, and a viscosity of 15 to 60 cSt at 40° C., measured according to ASTM D-445.

One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.

One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.

The present invention relates to new compounds based on cardanol based which can be used as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these 5 compositions, in particular in a potting process in electrical and electronic components and devices.

The present invention relates to new compounds based on cardanol based which can be used as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these 5 compositions, in particular in a potting process in electrical and electronic components and devices.

The present invention provides recyclable copper clad laminates (CCLs) each including copper coil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).