Patent classifications
C08G59/54
THREE-DIMENSIONAL PRINTING
An example of a three-dimensional (3D) printing kit includes a build material composition, an epoxy agent to be applied to at least a portion of the build material composition during 3D printing, and a fusing agent to be applied to the at least the portion of the build material composition during 3D printing. The build material composition includes a polyamide having an amino functional group. The epoxy agent includes an epoxy having an epoxide functional group to react with the amino functional group of the polyamide in the at least the portion. The fusing agent includes an energy absorber.
EPOXY COMPOSITION COMPRISING A BIO-BASED EPOXY COMPOUND
The present invention relates to an epoxy composition comprising a) an epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:
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The composition according to the present invention can be used as a structural adhesive, a coating and a primer.
EPOXY COMPOSITION COMPRISING A BIO-BASED EPOXY COMPOUND
The present invention relates to an epoxy composition comprising a) an epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:
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The composition according to the present invention can be used as a structural adhesive, a coating and a primer.
FAST CURING OIL TOLERANT ADHESIVE COMPOSITIONS
A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic lipid in an amount of from 10 to 50 wt.-% based on the total weight of part (A), and at least one inorganic filler material in an amount of from 10 to 60 wt.-% based on the total amount of part (A); and a second part (B) comprising: at least one first epoxy resin in an amount of from 15 to 60 wt.-% based on the total amount of part (B)), at least one viscosity modifier in an amount of from 1 to 25 wt.-%, based on the total weight of part (B), and at least one epoxy-reactive flexibilizer in an amount of from 0.1 to 10 wt.-% based on the total amount of part (B).
Three-dimensional printing
In an example of a method for three-dimensional (3D) printing, a build material composition is applied to form a build material layer. The build material composition includes a polyamide. The polyamide is selectively melted, based on a 3D object model, in at least a portion of the build material layer to form a molten portion including molten polyamide. An epoxy agent is selectively applied, based on the 3D object model, on the molten portion of the build material layer. The epoxy agent includes a polyfunctional epoxy, which crosslinks the molten polyamide in the molten portion.
THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME
A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME
A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
TWO-COMPONENT AQUEOUS EPOXY RESIN PAINT
The present application is directed to a two-component aqueous epoxy resin paint comprising: a) an aqueous epoxy resin emulsion comprising a low epoxy equivalent epoxy resin having an epoxy equivalent weight ranging from 400 to 700 g/eq and a high epoxy equivalent epoxy resin having an epoxy equivalent weight of greater than 800 g/eq, and b) a curing agent, wherein a weight ratio of the low epoxy equivalent epoxy resin to the high epoxy equivalent epoxy resin is in the range of 5:5 to 9:1; and wherein the aqueous epoxy resin emulsion is a stable emulsion.
TWO-COMPONENT AQUEOUS EPOXY RESIN PAINT
The present application is directed to a two-component aqueous epoxy resin paint comprising: a) an aqueous epoxy resin emulsion comprising a low epoxy equivalent epoxy resin having an epoxy equivalent weight ranging from 400 to 700 g/eq and a high epoxy equivalent epoxy resin having an epoxy equivalent weight of greater than 800 g/eq, and b) a curing agent, wherein a weight ratio of the low epoxy equivalent epoxy resin to the high epoxy equivalent epoxy resin is in the range of 5:5 to 9:1; and wherein the aqueous epoxy resin emulsion is a stable emulsion.
Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same
Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.