The present disclosure relates to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby and, specifically, to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby, wherein the epoxy resin is curable in conditions of 110-130° C./10 min and thus can be used even in a material, of which the temperature is difficult to raise or which is sensitive to heat.

The present invention provides a powder coating composition capable of forming a uniform coating film being superior in edge cover property and superior in insulation property. In addition, by a method for forming a coating film in which the coating composition according to the present invention is used, heating can be performed at low temperature. The powder coating composition comprises a bisphenol A type epoxy resin (A), a phenolic curing agent (B), and a curing accelerator (C) as coating film forming components.

Provided is a method for preparing an epoxy compound having an alkoxysilyl group effectively by using a mild catalyst as well as an aromatic alcohol ring-opening agent. The preparation method for an epoxy compound having an alkoxysilyl group includes: performing a ring opening step by reacting an epoxy compound having an epoxide group, which is a starting material, with an aromatic alcohol ring-opening agent in the presence of a phosphine-based catalyst and an optional solvent so as to obtain an intermediate having a partially ring-opened epoxide group; and performing an alkoxysilylation step by reacting the intermediate having a partially ring-opened epoxide with isocyanate alkoxysilane.

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.

An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties can be obtained. In addition, another object of the present invention is to provide a thermally conductive material formed of the composition for forming a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

A composition for forming a thermally conductive material of the present invention includes an epoxy compound, an inorganic substance, and a compound X containing one or more functional groups selected from the group consisting of an alkenyl group, an acrylate group, a methacrylate group, a silyl group, an acid anhydride group, a cyanate ester group, an amino group, a thiol group, and a carboxylic acid group, or having a polyamic acid structure, in which a content of the inorganic substance is 10% by mass or more with respect to a total solid content of the composition, and a content of the compound X is 10% by mass or more with respect to the total solid content of the composition.

A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ.sub.200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m.Math.K) or higher.

A solid resin molding material according to the present invention includes a thermosetting resin (A), a curing agent (B), a carboxylic acid-based dispersant (C), and magnetic particles (D).

The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.