There are provided an active ester composition that has high curability and that provides a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance; a cured product of the composition; and a semiconductor sealing material and a printed wiring board that are formed from the composition. Specifically, an active ester composition containing an active ester compound and a benzoxazine compound as essential components is provided. Because the active ester composition containing the active ester compound and the benzoxazine compound as essential components is characterized by having high curability with a curing agent and providing a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance, the active ester composition is suitable for use as a resin material for semiconductor sealing materials and printed wiring boards.

A hardener component is useful for a multi-component epoxy resin material, and includes a benzoxazine amine adduct as an accelerator and an amine as a hardener. The benzoxazine amine adduct is present in the hardener component in a proportion of from 8.5 wt. % to 75 wt. %. The multi-component material including the benzoxazine amine adduct in the hardener component already has a quick curing time at room temperature and can therefore be used advantageously for the chemical fastening of construction elements.

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.

The present invention relates to an amine-based curing agent comprising at least 1% by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine tertiary amine and, more preferably, N-hydroxyethyl piperidine (NHEP). The present invention also relates to an epoxy resin composition formed using this amine-based curing agent and a method of making the epoxy resin composition. These tertiary amines enhance desirable properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with tertiary amine-based curing agents.

The present invention relates to an amine-based curing agent comprising at least 1% by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine tertiary amine and, more preferably, N-hydroxyethyl piperidine (NHEP). The present invention also relates to an epoxy resin composition formed using this amine-based curing agent and a method of making the epoxy resin composition. These tertiary amines enhance desirable properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with tertiary amine-based curing agents.

A preparation method of thermadapt shape memory polymers includes: (1) synthesis of pendant hydroxyl groups functionalized epoxy oligomer using epoxy resin and alcohol amine; (2) synthesis of alkoxyl groups terminated silane crosslinking agent by isocyanate silane coupling agent and diamine; (3) crosslinked shape memory polymers were prepared by condensation reaction of pendant hydroxyl groups functionalized epoxy oligomer and alkoxyl groups terminated silane crosslinking agent. The thermadapt shape memory polymers show high glass transition temperatures and high tensile strength. The original shape of thermadapt shape memory polymers can be reconfigured to a new permanent shape as needed, and thus effectively solving the bottleneck problems of reprocessing or reshape in the traditional crosslinked polymers once after molding. The thermadapt shape memory polymers are suitable for smart materials based on shape memory polymers with complex three-dimensional permanent shapes, and showing unfolding or folding behaviors along with convert to three-dimensional structures under heat stimulation.

An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.

An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.

Room temperature curing, two-component epoxy adhesives useful in bonding oily substrates include a resin side A and a curative side B. The resin side A includes an epoxy resin, a toughening component, a plasticizer and filler, and the curative side B includes a polyetheramine, amine-terminated butadiene rubber and a curing catalyst.