The present invention relates to a composition containing, besides a thermosetting resin of epoxy type and a hardener of anhydride type, at least one catalyst comprising an organometallic titanium complex. This composition enables the manufacture of vitrimer resins, that is to say resins that can be deformed in the thermoset state. It also relates to a kit for manufacturing this composition, an object obtained from this composition and a kit for manufacturing this object. Another subject of the invention relates to an organometallic titanium complex corresponding to the structure titanium bis(3-phenoxy-1,2-propane dioxide) (Ti(PPD).sub.2), and the use thereof as vitrimer effect catalyst in systems based on epoxy resin and on hardener of anhydride type.

The invention relates to the use of aryliodonium and/or arylsulfonium salts of the tetrakis(perfluoro-t-butyloxy)aluminate anion of the following formula (I):

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as cationic initiators cleavable by light and/or free radicals for polymerizing cationically polymerizable monomers.

A thermally curable epoxy system includes 94 to 99.98 wt % of an epoxide component, 0.01 to 5% wt% of a toughener, 0.005 to 1.5 wt % of a catalyst, and 0.005 to 1.5 wt % of a co-catalyst.

The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one cycloaliphatic epoxide. The reaction product may have a glass transition temperature greater than or equal to 140 C. as measured by DMA.

A two-part curable resin composition contains the following agents A and B. The agent A is a composition containing a component (a) and a component (b). The component (a) is an epoxy resin having two or more epoxy groups in one molecule. The component (b) is an alkoxide-based aluminum catalyst. The agent B is a composition containing a component (c) and a component (d). The component (c) is an organic polymer having two or more hydrolyzable silyl groups. The component (d) is a curing agent for the component (a).

The present invention relates to a composition containing, besides a thermosetting resin of epoxy type and a hardener of anhydride type, at least one catalyst comprising an organometallic titanium complex. This composition enables the manufacture of vitrimer resins, that is to say resins that can be deformed in the thermoset state. It also relates to a kit for manufacturing this composition, an object obtained from this composition and a kit for manufacturing this object. Another subject of the invention relates to an organometallic titanium complex corresponding to the structure titanium bis(3-phenoxy-1,2-propane dioxide) (Ti(PPD).sub.2), and the use thereof as vitrimer effect catalyst in systems based on epoxy resin and on hardener of anhydride type.

A phenolic epoxy resin and a method for manufacturing the same are provided. The method for manufacturing the phenolic epoxy resin includes: reacting cardanol and vanillin for a polycondensation reaction at a temperature ranging from 60 C. to 90 C. so as to form a phenolic resin; injecting the phenolic resin, epichlorohydrin, and a surfactant into a reactor; adding a first basic solution for a dehydration reaction at a temperature ranging from 55 C. to 65 C.; when an equivalent of a hydroxyl group of the phenolic resin is lower than 3% of the original equivalent of the hydroxyl group of the phenolic resin, adding a second basic solution for a ring-closure reaction at a temperature ranging from 60 C. to 70 C., so as to obtain a phenolic epoxy resin. The surfactant is an alcohol ether solvent.

Connection resistance can be reduced when an electroconductive composition is used to electrically connect base metals each other or electrically connect a base metal and another material. The connection resistance can be reduced when at least one base metal is used as an object to be electrically connected. An electroconductive composition contains components (A) to (D): a component (A): an epoxy resin; a component (B): a thermally curing agent; a component (C): a nickel powder as an electroconductive powder; and a component (D): an organoaluminum complex.