Patent classifications
C08G59/685
Metal-clad laminate, metal member with resin, and wiring board
The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 m or less.
LATENT CURING ACCELERATORS
A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[XCOCH.sub.2CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes Oor NR.sub.1, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70 C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.
ANHYDRIDE EPOXY CURING AGENTS HAVING IMIDAZOLE SALT ADDITIVES FOR EPOXY RESIN SYSTEMS
A curing agent composition including at least one imidazole salt represented by the structure:
##STR00001##
where R, R, is H, or alkyl (1-20 carbon atoms) preferably lower alkyl of 1-7 carbon atoms, haloalkyl (1-20 carbon atoms), aryl, hydroxyl alkyl (1-7 carbon atoms), ester group(s), substituted alkyl and X.sup. is a carboxylate anion of 1-40 carbon atoms; and at least one anhydride curing agent. The disclosed imidazole salts when combined with the anhydride curing agent provide improved latency for epoxy systems while maintaining reactivity at elevated temperature. Epoxy compositions, cured epoxy products and methods for forming cured epoxy products are also disclosed.
LATENT CATALYST MIXTURE FOR EPOXY/ANHYDRIDE COMPOSITIONS
A composition comprising, consisting of, or consisting essentially of a) an epoxy resin; b) an anhydride hardener; and c) a latent catalyst which is a mixture of i) a Lewis acid catalyst; and ii) an imidazolium acetate catalyst, is disclosed.
METAL-CLAD LAMINATE, METAL MEMBER WITH RESIN, AND WIRING BOARD
The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 m or less.
Titanium-based catalyst for vitrimer resins of epoxy/anhydride type
The present invention relates to a composition containing, besides a thermosetting resin of epoxy type and a hardener of anhydride type, at least one catalyst comprising an organometallic titanium complex. This composition enables the manufacture of vitrimer resins, that is to say resins that can be deformed in the thermoset state. It also relates to a kit for manufacturing this composition, an object obtained from this composition and a kit for manufacturing this object. Another subject of the invention relates to an organometallic titanium complex corresponding to the structure titanium bis(3-phenoxy-1,2-propane dioxide) (Ti(PPD).sub.2), and the use thereof as vitrimer effect catalyst in systems based on epoxy resin and on hardener of anhydride type.
Multi-component composition for additive manufacturing
A multi-component composition for additive manufacturing, and related methods, are generally described.
METHODS OF FORMING DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS
Methods for preparing pre-dynamic cross-linked polymer compositions are described. Methods of preparing dynamic cross-linked polymer compositions using pre-dynamic cross-linked polymer compositions are also described.
Epoxy systems employing triethylaminetetraamine and tin catalysts
The invention relates to curable epoxy resin systems comprising polyethylene tetraamine and a tin catalyst as hardening agents, and optionally comprising 1,4-diaza[2.2.2]bicyclo octane. The invention also relates to articles made therefrom, including composites such as carbon fiber reinforced composites. The curable epoxy resins have rapid demold times and/or high glass temperature.
THERMOSETTING RESIN COMPOSITION, ELECTRONIC PART, ELECTRIC MACHINE COIL, ELECTRIC MACHINE, AND CABLE
It is an object of the present invention to provide a thermosetting resin composition which allows stress relaxation in an ester exchange reaction and the long-term use of the thermosetting resin composition having such a structure. A thermosetting resin composition of the present invention contains: an ester bond; and a functional group protected by a protecting group. The functional group is deprotected by external stimulus. The functional group and the ester bond can be subjected to an ester exchange reaction.