The disclosure relates to an accelerator composition for the cure of epoxy resins with aromatic amines comprising: (a) a metal complex with carboxylate ligands; and (b) a boron trifluoride amine complex or a boron trifluoride phenol complex. The disclosure also relates to a curing composition for the cure of epoxy resin comprising: (i) an aromatic amine as curing agent; and (ii) the above accelerator composition or, alternatively, a mixture of (1) a metal complex with carboxylate ligands and (2) neat boron trifluoride or boron trifluoride etherate for in-situ formation of a boron trifluoride amine complex with the aromatic amine. Additionally, the disclosure relates to the use of such compositions and to a cured resin product obtainable from the use of such compositions.

Connection resistance can be reduced when an electroconductive composition is used to electrically connect base metals each other or electrically connect a base metal and another material. The connection resistance can be reduced when at least one base metal is used as an object to be electrically connected. An electroconductive composition contains components (A) to (D): a component (A): an epoxy resin; a component (B): a thermally curing agent; a component (C): a nickel powder as an electroconductive powder; and a component (D): an organoaluminum complex.

A compound comprising polyacetoacetate functionality and at least one urethane linkage is disclosed. A coating composition comprising the (i) compound comprising polyacetoacetate functionality and at least one urethane linkage, (ii) a blocked polyamine, and (iii) a polyepoxide reactive with the condensation product of (i) and (ii) is also disclosed. A method of preparing a compound comprising polyacetoacetate functionality and at least one urethane linkage is also disclosed.