C08G63/133

TWO-DIMENSIONAL POLYMERS COMPRISED OF A COMBINATION OF STIFF AND COMPLIANT MOLECULAR UNITS

A family of new and novel molecules for mechanically superior two-dimensional (2D) polymers is described herein. By combining stiff carbon-containing cyclic polymer nodal units with more compliant linear polymer bridge units in an ordered, 2D repeating molecular structure it is possible to tailor the mechanical properties of 2D polymers and their assemblies to provide high stiffness, strength, and toughness. Furthermore, the inherent dimensionality of 2D polymers and their ability to be stacked into ordered and chemically interactive ensembles gives them inherent benefits in a variety of barrier and structural applications over current stiff and strong linear polymer technologies.

SURFACE TEXTURING FOR ADVANCED POLYMERS

Surface micro-texturing has been proven an effective way to reduce friction and wear for tribological applications. There is provided a low cost hot sintering method to apply micro-texturing on an advanced bearing polymer material. First, one face of the mold was micro-textured using a micro-casting method. Second, the cured Aromatic Thermosetting coPolyester (ATSP) powder was filled in the mold. Next, the filled mold was placed in a hot press for a hot sintering process. Finally, the textured bulk ATSP was cooled. The micro-textured ATSP bulk material was machined and compared with plain untextured material. The micro-textured material could effectively reduce friction at speeds lower than 2.46 m/s: 14% reduction in average.

Two-dimensional polymers comprised of a combination of stiff and compliant molecular units

A family of new and novel molecules for mechanically superior two-dimensional (2D) polymers is described herein. By combining stiff carbon-containing cyclic polymer nodal units with more compliant linear polymer bridge units in an ordered, 2D repeating molecular structure it is possible to tailor the mechanical properties of 2D polymers and their assemblies to provide high stiffness, strength, and toughness. Furthermore, the inherent dimensionality of 2D polymers and their ability to be stacked into ordered and chemically interactive ensembles gives them inherent benefits in a variety of barrier and structural applications over current stiff and strong linear polymer technologies.

Two-dimensional polymers comprised of a combination of stiff and compliant molecular units

A family of new and novel molecules for mechanically superior two-dimensional (2D) polymers is described herein. By combining stiff carbon-containing cyclic polymer nodal units with more compliant linear polymer bridge units in an ordered, 2D repeating molecular structure it is possible to tailor the mechanical properties of 2D polymers and their assemblies to provide high stiffness, strength, and toughness. Furthermore, the inherent dimensionality of 2D polymers and their ability to be stacked into ordered and chemically interactive ensembles gives them inherent benefits in a variety of barrier and structural applications over current stiff and strong linear polymer technologies.

Processing of aromatic thermosetting copolyesters into foams and bulk parts of adaptable density
10526465 · 2020-01-07 · ·

A novel Aromatic Thermosetting Copolyester (ATSP) fully dense sheets can be processed by recycling the foam structure with unique combination of properties including mechanical strength and high temperature performance (compared to PEEK) to help improve part functionality, gain long-term reliability and cost savings. ATSP machinable plates can be used in valves, fittings, bearing, bushing, seals, aerospace parts and pump components.

Polyester resin for toner, method for producing polyester resin for toner, and toner

The invention relates to a polyester resin for toner to be used in the development of an electrostatic image or magnetic latent image in electrophotography, electrostatic recording, electrostatic printing, or the like, a method for producing a polyester resin for toner, and a toner, and an object of the invention is to provide, with excellent productivity and stability, a polyester resin for toner having excellent storage stability, hot offset resistance, and low temperature fixing property as toner while still considering the environmental protection and safety. A polyester resin for toner contains 40 mol % or more and 60 mol % or less of structural units derived from tri- or higher hydric carboxylic acids based on 100 mol % of structural units derived from all acid components, and has a metal content of 100 ppm or less.

Polyester resin for toner, method for producing polyester resin for toner, and toner

The invention relates to a polyester resin for toner to be used in the development of an electrostatic image or magnetic latent image in electrophotography, electrostatic recording, electrostatic printing, or the like, a method for producing a polyester resin for toner, and a toner, and an object of the invention is to provide, with excellent productivity and stability, a polyester resin for toner having excellent storage stability, hot offset resistance, and low temperature fixing property as toner while still considering the environmental protection and safety. A polyester resin for toner contains 40 mol % or more and 60 mol % or less of structural units derived from tri- or higher hydric carboxylic acids based on 100 mol % of structural units derived from all acid components, and has a metal content of 100 ppm or less.

ACTIVE ESTER RESIN COMPOSITION AND CURED PRODUCT OF SAME
20190225744 · 2019-07-25 ·

Provided are an active ester resin composition capable of both exhibiting low shrinkage during curing and forming a cured product having a low elastic modulus under high temperature conditions; a curable resin composition including the ester resin composition; a cured product of the curable resin composition; a printed wiring board; and a semiconductor encapsulating material. The active ester resin composition includes an active ester compound (A) that is an esterification product of a naphthol compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and an active ester resin (B) including a product of reaction of essential raw materials including a compound (b1) having one phenolic hydroxyl group, a compound (b2) having two or more phenolic hydroxy groups, and an aromatic polycarboxylic acid or an acid halide thereof (b3), in which the content of the active ester compound (A) is 40% or more.

Processes for the formation of furandicarboxylic acid (FDCA) via a multistep biocatalytic oxidation reaction of 5-hydroxymethylfurfural (HMF)

The present invention relates to processes for the formation of furandicarboxylic acid (FDCA), in particular 2,5-furandicarboxylic acid (2,5-FDCA), and mono- and diester derivatives thereof, via a multistep biocatalytic oxidation reaction of 5-hydroxymethylfurfural (HMF) using, for example, an enzyme selected from the group consisting of xanthine oxidoreductase (XOR), galactose oxidase variant M.sub.3-5, aldehyde dehydrogenase, and/or ketoreductase. The invention also relates to copolymers that comprise the furandicarboxylic acid monomers and derivatives thereof, processes for the formation of the copolymers and uses for the copolymers.

ACTIVE ESTER RESIN AND CURED PRODUCT THEREOF
20190172768 · 2019-06-06 · ·

Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.