The present invention relates to a water-soluble co-polyester polymer. The polymer of the present invention is used for inline coating of BOPET film manufacturing, coating of BOPET film used as primer for vacuum metallization and surface coating of Aluminum sheets. The polymer of the present invention provides wide range of printability performances and high metal to film bond strength with minimum gain in weight. The disclosed polymer also provides Tape Test resistant printing and retort resistant layered/composite film.

The present invention relates to a water-soluble co-polyester polymer. The polymer of the present invention is used for inline coating of BOPET film manufacturing, coating of BOPET film used as primer for vacuum metallization and surface coating of Aluminum sheets. The polymer of the present invention provides wide range of printability performances and high metal to film bond strength with minimum gain in weight. The disclosed polymer also provides Tape Test resistant printing and retort resistant layered/composite film.

Linear, comb, and star shaped non-ionic polyesters and copolyesters, polyesteramides, polyamides, and copolyamides may be synthesized from the condensation polymerization of polyacids containing alpha-hydroxy polyacids and diols and/or polyols, and amino-diols and/or amines using boric acid, boric anhydride, and boronic acids as catalysts. Depending on the polyol, polyamine, and amino alcohol component, the resulting compound may be hydrophilic or hydrophobic, but not water soluble or dispersible, enabling use in packaging films, fibers, and other molded articles. The compounds may be completely water soluble, water dispersible, and/or amphipathic, thus being useful in cosmetics, agricultural compositions, biomedical and pharmaceutical applications.

Cyclohexanol-capped compounds and their use as plasticizers The presently claimed invention relates to a compound of formula (I) having cyclohexane end capping, (I). It further relates to a molding comprising said compound and its use as plasticizer. It also relates to the plasticizer composition comprising at least one compound of formula (I), as described herein.

A polyester pressure-sensitive adhesive composition is provided including a polyester resin having a predetermined amount of a structural unit derived from a hydrogenated polybutadiene structure-containing compound, or a polyester resin having a structural unit derived from a hydrogenated polybutadiene structure-containing compound and a predetermined amount of a structural unit derived from an aromatic ring structure-containing compound. The polyester pressure-sensitive adhesive composition has superior adhesion to a polyolefin base material and is highly transparency.

A polyester pressure-sensitive adhesive composition is provided including a polyester resin having a predetermined amount of a structural unit derived from a hydrogenated polybutadiene structure-containing compound, or a polyester resin having a structural unit derived from a hydrogenated polybutadiene structure-containing compound and a predetermined amount of a structural unit derived from an aromatic ring structure-containing compound. The polyester pressure-sensitive adhesive composition has superior adhesion to a polyolefin base material and is highly transparency.

A biodegradable film is prepared from a composition that includes a copolyester obtained by extrusion reaction of a branched aliphatic-aromatic copolyester derived from monomer a, monomer b, monomer c and monomer d with an organic peroxide. The film can be completely degraded into small molecular products such as carbon dioxide, water and the like under natural or composting conditions. Moreover, the film can be prepared having a thickness of 4-50 μm as required, and its mechanical properties can reach the same level as or even better than those of LDPE film.

A composition for forming a resist underlayer film which enables to form a flat film with a favorable coating even on a so-called stepped substrate and a small film thickness difference after embedding, and also a polymer as an important component of the composition for forming a resist underlayer film, a resist underlayer film formed using the composition for forming a resist underlayer film, and a method of producing a semiconductor device. The composition for forming a resist underlayer film, includes a compound of the following Formula (1) and a solvent:

##STR00001##

(wherein, Ar.sub.1, Ar.sub.2, Ar.sub.3 and Ar.sub.4 are each independently a substitutable monovalent aromatic hydrocarbon group, a, b, c, and d are each 0 or 1, and a+b+c+d=1).

A composition for forming a resist underlayer film which enables to form a flat film with a favorable coating even on a so-called stepped substrate and a small film thickness difference after embedding, and also a polymer as an important component of the composition for forming a resist underlayer film, a resist underlayer film formed using the composition for forming a resist underlayer film, and a method of producing a semiconductor device. The composition for forming a resist underlayer film, includes a compound of the following Formula (1) and a solvent:

##STR00001##

(wherein, Ar.sub.1, Ar.sub.2, Ar.sub.3 and Ar.sub.4 are each independently a substitutable monovalent aromatic hydrocarbon group, a, b, c, and d are each 0 or 1, and a+b+c+d=1).

An aliphatic-aromatic polyester resin comprising principal structural units that includes aliphatic dicarboxylic acid units, aromatic dicarboxylic acid units, and aliphatic diol units and/or alicyclic diol units, wherein an abundance ratio (molar ratio) between the aliphatic dicarboxylic acid units and the aromatic dicarboxylic acid units is 15:85 to 85:15; the aliphatic-aromatic polyester resin has a glass transition temperature of −25° C. or more; and the aliphatic-aromatic polyester resin has branched structures represented by formulae (1) to (4) below:

##STR00001## where Ar.sup.1, Ar.sup.2, and Ar.sup.3 each independently represent an optionally substituted divalent group having 4 to 12 carbon atoms, the optionally substituted divalent group being a divalent aromatic hydrocarbon group or a divalent aromatic heterocyclic group; R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and n, m, and r are each independently an integer of 2 to 10.