A method for preparing fire resistant polymeric materials including, providing at least one first polyphenol having three or more phenolic groups, reacting at least one first polyphenol having three or more phenolic groups with at least one halophosphate and at least one first base to produce at least one second phenol having at least one phosphate group, and converting at least one second phenol having at least one phosphate group to a thermoplastic or thermosetting fire resistant polymeric material.

A method for preparing fire resistant polymeric materials including, providing at least one first polyphenol having three or more phenolic groups, reacting at least one first polyphenol having three or more phenolic groups with at least one halophosphate and at least one first base to produce at least one second phenol having at least one phosphate group, and converting at least one second phenol having at least one phosphate group to a thermoplastic or thermosetting fire resistant polymeric material.

The present invention relates to brominated polyether polyols, processes for the production as well as intermediates useful in the production of the same and to processes for the preparation of flame-retardant blends, premixes as well as polyurethane foams.

The present invention relates to brominated polyether polyols, processes for the production as well as intermediates useful in the production of the same and to processes for the preparation of flame-retardant blends, premixes as well as polyurethane foams.

A highly damping homogenous elastomeric polymer blend. The elastomeric polymer blend comprises from about 50% to about 95 wt % epihalohydrin and from about 5% to about 50 wt % polymethylmethacrylate. The blend is homogenous and has a vertical rebound between 0 and about 10% and a Tg between about 20 C. and about 45 C. when measured by rheology.

An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

##STR00001##

An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

##STR00001##

The present invention relates to a package or a portion thereof having an interior food-contacting surface and a coating composition being substantially free of bisphenol A and reaction products thereof applied to the interior surface; wherein the coating composition comprises a polyhydroxy ether and a curing agent for the polyhydroxy ether and in which the polyhydroxy ether is prepared from reacting epichlorohydrin with a polyhydric phenol having the following structure (I), as shown in claim 1; where R.sub.1 is independently an organic group having a molecular weight of at least 15 Daltons or R.sub.1 can optionally join together with another R.sub.1 to form a fused aromatic ring that is similarly substituted with the R.sub.1 organic group; y=4, x=1 to 2; each of the arylene groups in structure (I) includes at least one R.sub.1 attached to the arylene ring at the ortho and/or meta position relative to the phenolic hydroxyl group; m is 0 to 1; R.sub.2 if present is a divalent organic group; n is 0 to 1 with the proviso that if n is 0, m is 0; the polyhydroxy ether having an Mn of from 2000 to 10,000 and containing at least 70 percent by weight of groups of the structure (II), as shown in claim 1, based on weight of the polyhydroxy ether.

The present invention relates to a package or a portion thereof having an interior food-contacting surface and a coating composition being substantially free of bisphenol A and reaction products thereof applied to the interior surface; wherein the coating composition comprises a polyhydroxy ether and a curing agent for the polyhydroxy ether and in which the polyhydroxy ether is prepared from reacting epichlorohydrin with a polyhydric phenol having the following structure (I), as shown in claim 1; where R.sub.1 is independently an organic group having a molecular weight of at least 15 Daltons or R.sub.1 can optionally join together with another R.sub.1 to form a fused aromatic ring that is similarly substituted with the R.sub.1 organic group; y=4, x=1 to 2; each of the arylene groups in structure (I) includes at least one R.sub.1 attached to the arylene ring at the ortho and/or meta position relative to the phenolic hydroxyl group; m is 0 to 1; R.sub.2 if present is a divalent organic group; n is 0 to 1 with the proviso that if n is 0, m is 0; the polyhydroxy ether having an Mn of from 2000 to 10,000 and containing at least 70 percent by weight of groups of the structure (II), as shown in claim 1, based on weight of the polyhydroxy ether.

An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P: ##STR00001##