Patent classifications
C08G65/24
Leveler compositions for use in copper deposition in manufacture of microelectronics
An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P: ##STR00001##
Copper Deposition in Wafer Level Packaging of Integrated Circuits
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor, and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.
Copper Deposition in Wafer Level Packaging of Integrated Circuits
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor, and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.
POLYETHER POLYMER COMPOSITION
A polyether polymer composition containing 50 parts by weight or more of a filler per 100 parts by weight of a polyether polymer composed of 10 to 200 oxirane monomer units is provided. The present invention can provide a polyether polymer composition that is capable of appropriately showing various properties of the filler such as high heat conductivity and high electrical conductivity and that also has excellent long-term stability.
POLYETHER POLYMER COMPOSITION
A polyether polymer composition containing 50 parts by weight or more of a filler per 100 parts by weight of a polyether polymer composed of 10 to 200 oxirane monomer units is provided. The present invention can provide a polyether polymer composition that is capable of appropriately showing various properties of the filler such as high heat conductivity and high electrical conductivity and that also has excellent long-term stability.
POLYETHER POLYMER COMPOSITION, METHOD FOR PRODUCING SAME, AND SHEET IN WHICH SAME IS USED
A polyether polymer composition containing 200 parts by weight or more of a metal-containing powder per a total of 100 parts by weight of a cationic group-containing low molecular weight polyether polymer composed of 10 to 200 oxirane monomer units, wherein at least a part of the oxirane monomer units is an oxirane monomer unit having a cationic group, and a high molecular weight polyether polymer composed of more than 200 oxirane monomer units is provided.
CROSSLINKABLE RUBBER COMPOSITION, CROSSLINKED RUBBER, AND ELECTRO-CONDUCTIVE MEMBER
A cross-linkable rubber composition including a polyether rubber, a cross-linking agent, and zinc peroxide is provided, the polyether rubber including 0.1 to 30 mol % of a unit represented by the following general formula (1) and 1 to 15 mol % of an unsaturated oxide monomer unit:
##STR00001##
wherein A.sup.+ is a group containing a cationic nitrogen-containing aromatic heterocyclic ring; the group containing a cationic nitrogen-containing aromatic heterocyclic ring bonds to a carbon atom at the position 2 shown in the above general formula (1) through one of nitrogen atoms constituting the cationic nitrogen-containing aromatic heterocyclic ring.
CROSSLINKABLE RUBBER COMPOSITION, CROSSLINKED RUBBER, AND ELECTRO-CONDUCTIVE MEMBER
A cross-linkable rubber composition including a polyether rubber, a cross-linking agent, and zinc peroxide is provided, the polyether rubber including 0.1 to 30 mol % of a unit represented by the following general formula (1) and 1 to 15 mol % of an unsaturated oxide monomer unit:
##STR00001##
wherein A.sup.+ is a group containing a cationic nitrogen-containing aromatic heterocyclic ring; the group containing a cationic nitrogen-containing aromatic heterocyclic ring bonds to a carbon atom at the position 2 shown in the above general formula (1) through one of nitrogen atoms constituting the cationic nitrogen-containing aromatic heterocyclic ring.
Rubber composition and tire
The present invention aims to provide rubber compositions and tires which provide improved overall performance in terms of wet grip performance and dry grip performance. The present invention relates to a rubber composition having a hardness that reversibly changes with water and satisfying the following relationship (1):
Hardness when dry?Hardness when water-wet?10(1)
wherein each hardness represents the JIS-A hardness at 25? C. of the rubber composition.
IONIC COMPOSITION AND CROSSLINKED PRODUCT
An ionic composition including an ionic liquid and a polyether compound having a cationic group is provided. The present invention can provide an ionic composition having a very low vapor pressure, low flammability, and excellent low-temperature properties.