A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.

A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols having identical substituents in the 2- and 6-positions of the phenolic ring, and an absolute number average molecular weight of 1,000 to 10,000 grams/mole. A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol, 2,6-dimethylphenol, and a dihydric phenol in a non-halogenated solvent is also useful in curable compositions. This copolymer has an absolute number average molecular weight of 1,000 to 5,000 grams/mole. A cured composition is obtained by heating curable compositions composed of the poly(phenylene ether) copolymer solutions and thermoset resins for a time and temperature sufficient to evaporate the non-halogenated solvent and effect curing. The compositions can be used for preparation of composites for printed circuit boards.

Provided is a polyphenylene ether resin composition whose mechanical properties are difficult to be changed through high temperature aging (e.g. 145 C.) while heat resistance and mechanical and electrical properties are maintained. When the bend elastic constant of the polyphenylene ether resin composition before aging measured in accordance with ISO-178 in an atmospheric air is taken as 100%, time required for the bend elastic constant to be 115% or more through aging in which the polyphenylene ether resin composition is left at rest at 150 C. is 2,000 hours or more; and a shaped article of 12.6 cm in length, 1.3 cm in width, and 1.6 mm in thickness formed from the polyphenylene ether resin composition exhibits a rate of change in chloroform-insoluble content of 15 mass % or less before and after aging in which the shaped article is left at rest for 1,000 hours at 150 C.

The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.

A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.

A cation-conducting polymer has two or more repeating units of the following formula

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Owing to the cation-conducting polymer has good physicochemical properties, hydrolytic stability and conductivity, a film formed by coating the liquid cation-conducting polymer can be used as proton exchange membrane to apply in fuel cell system.

Provided is a novel fluororesin useful as an electronic substrate material for high speed transmission. The fluorine resin has the structure of Formula (I), wherein n is within a range of 1 to 100, L has the structure in Formula (II) or Formula (III), R.sup.1 and R.sup.2 are independently hydrogen atoms, C.sub.1 to C.sub.10 alkyl groups, C.sub.1 to C.sub.10 haloalkyl groups, or C.sub.6 to C.sub.10 aryl groups, or R.sup.1 and R.sup.2 may be combined to form a ring structure that may include a substituent, R.sup.3 and R.sup.4 are each independently hydrogen, fluorine, C.sub.1 to C.sub.10 saturated or unsaturated hydrocarbon groups in which a portion of or all hydrogens may be substituted with a halogen, and C.sub.6 to C.sub.10 aryl groups in which a portion of or all hydrogens may be substituted with a halogen, and X is a group containing an olefinic carbon-carbon double bond or a carbon-carbon triple bond and at least one fluorine atom.

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A polycarbonate copolymer which has siloxane constituent units represented by any of formulae (1-1) to (1-4) and prescribed polycarbonate constituent units.

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A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3-bis(halophthalimide)s, 3,4-bis(halophthalimide)s, 4,4-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.

The present application relates to a phthalonitrile resin, a polymerizable composition, a prepolymer, a composite, a preparation method therefor, and a use thereof. The present application can provide: phthalonitrile having excellent curability, exhibiting a suitable process temperature and a wide process window, and capable of forming a composite having excellent physical properties; a polymerizable composition using the same; and a prepolymer.