A resin composition containing a liquid crystal polymer (A) and a predetermined polyimide resin (B), wherein the liquid crystal polymer (A) contains at least one repeating structural unit selected from the group consisting of repeating structural units represented by the following formulas (I) to (IV), and a molded article containing the same:

##STR00001##

wherein a, b, and c represent an average number of repeating structural units.

Compositions including a polyimide and one or more thermally conductive fillers, and compaction rollers for an automated fiber placement machine incorporating the compositions are provided. The polyimide may be a polymeric reaction product of a dianhydride and one or more diamines. The one or more diamines may include a fluorine-containing alkyl ether diamine. The one or more thermally conductive fillers may include one or more of a carbon-based filler, boron nitride, a metal, or combinations thereof. The compositions may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm.sup.−1 K.sup.−1).

Described is a polyimide prepared from a diamine containing a spiro or cardo group in a molecule structure, wherein the dimensional stability of the polyimide can be improved at a high temperature, and thus the polyimide can provide a polyimide film useful for a flexible substrate.

A method for producing a polyimide film includes: providing a polyimide coating solution; providing a high temperature resistant polyester substrate; and coating the polyimide coating solution on the high temperature resistant polyester substrate, so that a polyimide wet coating is formed on the high temperature resistant polyester substrate; implementing a first baking step, which includes: baking the polyimide wet coating at a first temperature of between 60° C. and 130° C. to remove a part of organic solvent in the polyimide wet coating; implementing a second baking step, which includes: baking the polyimide wet coating at a second temperature of between 140° C. and 220° C. to remove a residual part of the organic solvent in the polyimide wet coating, so as to form the polyimide film on the high temperature resistant polyester substrate; and separating the polyimide film and the high temperature resistant polyester substrate from each other.

Resin composition including an epoxy resin, an epoxy resin curing agent, and a polyimide resin including a specified structural unit provide a high yield after patterning.

Disclosed in the present disclosure are an ultra-high modulus and high-transmittance polyimide thin film, and a preparation method and application therefor. The ultra-high modulus and high-transmittance polyimide thin film is prepared by means of mixing and dissolving polydiamine and polydianhydride in a solvent, adding an end-capping reagent, and performing polymerization reaction and imidization. The ultra-high modulus and high-transmittance polyimide thin film has an ultra-high modulus and high transmittance, and is applicable to fields such as flexible photoelectricity and aerospace, especially to a structural member, a reinforcement layer or a substrate of flexible display and transparent display.

A polyimide precursor, a preparation method thereof, a photosensitive resin composition and a cured product are provided. The polyimide precursor is obtained from a tetracarboxylic dianhydride (A), a diamine (B), and a hydroxyl-containing alkyl (meth)acrylate (C) through ring-opening substitution, and polymerization. The polyimide precursor does not include fluorine. The tetracarboxylic dianhydride (A) and the diamine (B) form a main chain. The hydroxyl-containing alkyl (meth)acrylate (C) is grafted to the main chain to form a branch. A molar ratio of the tetracarboxylic dianhydride (A) to the diamine (B) if from 1:0.95 to 1:1.10.

There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a conductive polymer, the conductive polymer includes a conjugated polymer and a dopant, and the dopant includes a dopant having a molecular volume of 0.08 nm.sup.3 or more.

Amine-substituted copolymers that may include an amine-substituted pyrrolidine-2,5-dione moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diamine. Articles, such as wires, having a surface on which a polyimide is disposed. Methods for forming polymers.

A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.