Provided are a thermosetting resin composition which is soluble in a general-purpose solvent and which can obtain a cured product (cured film) having high optical transparency to the ultraviolet region (approximately 300 nm) from the visible region, and a polyamide-imide resin suitable for use in preparing the thermosetting resin composition. Specifically, provided are an alcohol-modified polyamide-imide resin, which is obtained by reacting an isocyanurate type polyisocyanate (a1) synthesized from an isocyanate having an aliphatic structure with a tricarboxylic anhydride (a2) to prepare a polyamide-imide resin (a), and then reacting the polyamide-imide resin (a) with an alcohol compound (b); a curable resin composition containing the polyamide-imide resin; and a cured product of the curable resin composition.

Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100 C. and D.sub.(S-P) represented by a formula (1) satisfying a relationship of D.sub.(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 1010.sup.4 to 3010.sup.4 or a number-average molecular weight of the polyamide-imide is 210.sup.4 to 510.sup.4.

D.sub.(S-P)=[(dD.sup.SdD.sup.P).sup.2+(dP.sup.SdP.sup.P).sup.2+(dH.sup.SdH.sup.P).sup.2].sup.1/2(1)

The present invention provides a polyamide-imide, a method for preparing same, and a polyimide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus may be used in various fields such as substrates for device, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPCs), tapes, touch panels and protective films for optical discs.

A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.

A polyamideimide resin composition containing: (A) a polyamideimide resin which has isocyanate groups at the terminals and in which at least a portion of the isocyanate groups are blocked with a blocking agent selected from the group consisting of alcohols, oximes and lactams, (B) N-formylmorpholine, and (C) water.

A polyamideimide resin having isocyanate groups at the terminals, wherein at least a portion of the isocyanate groups are blocked with an ether group-containing cyclic amine.

There is provided a partial discharge-resistant paint that is excellent in the dispersibility of alumina particles, has an industrially suitable viscosity, and can form a coating that is excellent in partial discharge resistance and insulating properties. A partial discharge-resistant paint comprising at least one heat-resistant resin selected from the group consisting of a polyamide resin, a polyimide resin, a polyimide resin precursor, a polyamide-imide resin, a polyetherimide resin, and a polyester-imide resin; alumina particles having an aspect ratio of 2 to 99, and represented by the formula: Al.sub.2O.sub.3.Math.nH.sub.2O; at least one selected from the group consisting of an organophosphorous compound, a sulfonic acid compound, an amic acid compound, a triazole compound, a compound represented by formula (A) below, a compound represented by formula (B) below, a compound represented by formula (C) below, citric acid, ethylenediaminetetraacetic acid, and an ethylenediaminetetraacetic acid derivative; and a solvent, wherein the solvent comprises 90% by mass or more of a solvent having a boiling point of 100? C. or more at a pressure of 1 atm, the alumina particle content is 10 to 30% by mass relative to a total of 100% by mass of the heat-resistant resin and the alumina particles, and a total content of the heat-resistant resin and the alumina particles is 10 to 30% by mass. ##STR00001##

A coating composition comprising: a) a polyester imide polymer having an acid value of at least 25 mg KOH/g and a hydroxyl value of up to 5 mg KOH/g; and b) a crosslinker material operable to crosslink the acid functionality of the polyester imide polymer, wherein the coating composition is substantially free of bisphenol A (BRA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

The present invention relates to novel block copolyimides for preparing highly selective integrally asymmetrical gas separation membranes of improved permeance, processes for preparing these block copolyimides, membranes prepared from the block copolyimides, and also the use of the block copolyimides and of the membranes prepared therefrom.