Amine-substituted copolymers that may include an amine-substituted pyrrolidine-2,5-dione moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diamine. Articles, such as wires, having a surface on which a polyimide is disposed. Methods for forming polymers.

The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon 02 plasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.

According to one or more embodiments, a pharmaceutical package may include a glass container and a coating. The glass container may include a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The coating may be positioned over at least a portion of the first surface of the glass container. The coating may include one or more polyimide compositions and one or more metal oxide compositions. The one or more polyimide compositions and the one or more metal oxide compositions may be mixed in the coating.

In a first aspect, a polymer film includes a polyimide, wherein the polyimide includes two or more dianhydrides, including 15 to 35 mol % of a first monomer that is a crankshaft monomer and 15 to 35 mol % of a second monomer that is a flexible monomer, and two or more diamines, including 1 to 35 mol % of a third monomer that is a rotational inhibitor monomer and 15 to 49 mol % a fourth monomer that is a rigid rotational monomer, wherein the mol % of each monomer is based on the total of all four monomers. The polymer film has a dielectric dissipation loss factor, D.sub.f, of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less.

A modified polyamic acid, a preparation method thereof, and a preparation method of a composite film are provided. The modified polyamic acid includes polyamic acid and polyvinylidene fluoride. The modified polyamic acid is formed by introducing polyvinylidene fluoride having good thermal stability, high dielectric constant, excellent piezoelectric, and ferroelectric properties, so the dielectric constant and structural adjustability of the modified polyamic acid are improved.

A composition comprising a polyimide or a precursor thereof including a tetracarboxylic dianhydride residue and an amine residue having at least one aromatic group, and a clay mineral modified with an organic cation having at least one aromatic group, wherein the content of the clay mineral with respect to 100 parts by mass of the polyimide or a precursor thereof is more than 3.0 parts to 10 parts by mass, and wherein the cured product is colorless and transparent, or a polyimide film having a coefficient of linear expansion of 10 ppm or less, a glass transition temperature of 450° C. or more, a Yellow index of 10 or less, and a total light transmittance of 80% or more.

A polyimide precursor composition according to an exemplary embodiment includes an imide precursor having an organic group derived from a cyclic ether group-containing compound. A polyimide film formed using the polyimide precursor composition has improved heat resistance and mechanical properties, and has high absorbance in a wavelength range in an ultraviolet region.

A polyimide resin is obtained by polymerizing a modified polyphenylene ether resin with terminal amine groups and tetracarboxylic dianhydride. The polyimide has the following characteristics: the dissipation factor under 10 GHz electromagnetic wave is less than 0.0040; the water absorption rate is less than 0.3%; or, the temperature of glass transition is greater than 250° C.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.