Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.

Magnet wire with improved enamel adhesion is described. The magnet wire may include a conductor and a plurality of layers of polymeric enamel insulation material formed around the conductor. One or more first or primer coats of insulation may be formed from a polyimide material that includes a dianhydride component reacted with a diamine component that includes at least eighty percent by weight of BAPP. The BAPP provides enhanced adhesion between the insulation material and the conductor. One or more second or overcoat layers of insulation may be formed over the primer coat(s). The overcoat layer(s) may be formed from a polyimide material that includes a dianhydride component reacted with a diamine component that includes ODA.

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): ##STR00001##
and a diamine of Formula (2) or (3): ##STR00002##
wherein G, P, R, R.sub.x, P, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

A tetracarboxylic dianhydride represented by the following general formula (1):

##STR00001##

[in the formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydrogen atom and the like, and n represents an integer of 0 to 12], wherein a ratio of a summed amount of a specific stereoisomer (A) and a specific stereoisomer (B) is 50% by mole or more relative to a total amount of stereoisomers based on three-dimensional configurations of two norbornane rings in the general formula (1), and a content ratio of the stereoisomer (A) is 30% by mole or more relative to the total amount of the stereoisomers.

A method for producing an aqueous polyimide precursor solution composition includes forming a polyamic acid by the reaction of a tetracarboxylic acid component and a diamine component in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

A resin composition contains: (a) a resin which constitutes a polymer having a structure represented by any one of the following general formulae (1) to (3) below and/or a copolymer having the structure; and (b) a basic compound, ##STR00001##
wherein R.sup.1 is a C.sub.4-C.sub.30 organic group, R.sup.2 is a divalent C.sub.4-C.sub.30 organic group, X is a sulfonic group, hydroxy group, or carboxy group, p is 1 to 4, and n is 2 to 100,000; ##STR00002##
wherein R.sup.3 is a C.sub.4-C.sub.30 organic group, R.sup.4 is a divalent C.sub.4-C.sub.30 organic group, Y is a sulfonic group, hydroxy group, or carboxy group, q is 1 to 4, and m is 2 to 100,000; ##STR00003##
wherein R.sup.5 represents a C.sub.4-C.sub.30 organic group, R.sup.6 is a divalent C.sub.4-C.sub.30 organic group, Z is a sulfonic group, hydroxy group, or carboxy group, r is 1 to 4, and l is 2 to 100,000.

An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.

A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.