A porous polyimide film is provided to suppress an increase in a dielectric loss tangent even when immersed in water. In the porous polyimide film, a difference between a dielectric loss tangent T1 after being left to stand for 24 hours under an atmosphere of 25° C. and relative humidity of 50% and a dielectric loss tangent T2 after immersion in water for 24 hours under an atmosphere of 25° C. is 0.0030 or less.

A temporary protective film for semiconductor encapsulation molding, the temporary protective film including a support film, an adhesive layer provided on one surface of the support film, and a non-adhesive layer provided on a surface of the support film on an opposite side from the surface provided with the adhesive layer. The thickness of the non-adhesive layer is 10 μm or less. A surface of the non-adhesive layer on an opposite side of a surface in contact with the support film, has a surface roughness Ra of 0.1 μm or more.

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

Provides an alkali-resistant black matte polyimide film, including polyimide in an amount from 75 to 93 wt % of the alkali-resistant black matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide, wherein the dianhydride includes pyromellitic dianhydride (PMDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and the diamine includes p-Phenylenediamine (PDA) and 4,4′-oxydianiline (ODA), and wherein the BPDA is an amount from 2 to 35 wt % of the dianhydride, and the PDA is in an amount from 10 to 70 wt % of the diamine; carbon black in an amount from 2 to 8 wt % of the alkali-resistant black matte polyimide film; and polyimide micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 10 wt % of the alkali-resistant black matte polyimide film.

A polyimide-based composition includes a polyimide precursor and a solvent, in which the polyimide precursor includes repeating units represented by Chemical Formula 1 to 3. A polyimide film is also made from the composition.

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A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

Novel aromatic polyimides, both thermoplastic and thermosettable, are disclosed based on use of asymmetric diamines and symmetric dianhydrides with either a functional endcap for further thermosetting or a non-functional endcap for retention of thermoplastic properties. Both aromatic polyimides have sufficient physical properties to be useful in 3D printing.

An insulated electric wire includes a rectangular conductor and an insulation film disposed on the periphery of the rectangular conductor. The insulation film is characterized by: the provision of a resin containing an imide structure within a molecule; and a peak value of less than 1.0 for the loss tangent tan δ, which is represented by the ratio between the loss elastic modulus and the storage elastic modulus, as measured in the 50 DEG C. to 400 DEG C. range.