A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.

In a first aspect, a polyimide film includes a polyimide derived from a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride to diamine that forms the polyimide is in a range of from 0.85:1 to 0.99:1, and the polyimide film has a T.sub.g of 400° C. or higher, a tensile modulus of 6.0 GPa or more, and a coefficient of thermal expansion of 15 ppm/° C. or less over a temperature range of 50 to 500° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

A polyimide precursor includes a repeating unit of formulae (I) and (II):

##STR00001## where R1 and R3 are each a tetravalent group of a tetracarboxylic dianhydride residue, and R2 and R4 are respectively a divalent group of a residue of a first-type diamine and a divalent group of a residue of a second-type diamine. The first-type diamine is represented by formula (III), and the second-type diamine is represented by formula (IV). A resin composition including the polyimide precursor, a polyimide formed from the polyimide precursor, and use of the polyimide are also disclosed.

A thermoplastic composition includes 25 to 95 weight percent of a poly(etherimide); 5 to 70 weight percent of a polymer different from the poly(etherimide) that is partially miscible with the poly(etherimide); and 1 to 15 weight percent of a mineral filler having an average particle size of 0.1 to 10 micrometers; wherein each weight percent is based on the total weight of the composition. The thermoplastic composition can be prepared by melt-mixing the components of the composition. Articles including the composition are also described.

A method includes adding particles to an alkaline solution, stirring the solution to cause the particles to acquire hydroxyl groups producing activated particles, dispersing the activated particles into a solvent solution, adding acetylene benzoxazine into the solvent solution, mixing the solvent solution, removing the solvent from the solvent solution to produce acetylene-benzoxazine functionalized particles, and drying the acetylene-benzoxazine functionalized particles. A composition of matter has acetylene-benzoxazine functionalized particles dispersed in a resin.

Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000,

##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), ##STR00001## wherein R is a C.sub.6 aryl group, a C.sub.7-C.sub.8 aralkyl group, a C.sub.2-C.sub.6 alkoxyalkyl group, or a C.sub.3-C.sub.18 alkyl group; and 0.02≤X≤0.5.

The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).

A method of making diimide and dianhydride that includes contacting a nitro or halo N-substituted phthalimide with bisphenol in polar aprotic solvents, such as dimethylsulfoxide and sodium hydride to provide high conversion to a diimide; precipitating the product in acetic acid solution and filtration; treating the resulting solid, N-substituted diimide with a carboxylic acid and substituted or unsubstituted dimethyl sulfoxide in an aqueous medium to provide a reaction mixture including tetra acid, triacid, imide diacid and diimide along with substituted or unsubstituted acetic acid, dimethyl sulfoxide and their derivatives. The method includes the isolation of tetra acid by precipitation in water followed by centrifuge or filtration. The tetra acid is converted into the corresponding dianhydride. The dianhydride prepared by the method are also described as precursor to make polyetherimide.

A polyimide resin composition containing a polyimide resin (A) and a polyetherimide sulfone resin (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %; and a molded article containing the same.

##STR00001##

(R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)