Patent classifications
C08G73/1053
Resin composition
An object of the present invention is to provide a polyimide binder which can be prepared under lower temperature conditions. The binder composition for a secondary battery of the present invention is characterized in comprising a polyamic acid and an aromatic compound comprising an electron donating group and an organic acid group.
PROTON EXCHANGE MEMBRANE MADE OF A CRYSTALLINE SULFONATED POLYIMIDE BLOCK COPOLYMER, PREPARATION METHOD AND USE THEREOF
Disclosed are a proton exchange membrane made of a crystalline sulfonated polyimide block copolymer, a preparation method and use thereof. The crystalline sulfonated polyimide block copolymer has a chemical structure as shown in Formula (I), in which Ar1 group is an aromatic group containing a naphthyl group, Ar2 group is an aromatic group containing at least one sulfonate group, and x is in the range of 5-100, m is in the range of 1-200, and n is in the range of 5-500.
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RESIN COMPOSITION, FILM, COMPOSITE MATERIAL, MOVING BODY, AND THREE-DIMENSIONAL PRINTING MATERIAL
A resin composition with high heat resistance, melt formability, and secondary processability is provided. A resin composition containing: a poly(aryl ether ketone) resin (A); and a poly(ether imide sulfone) resin (B), wherein the poly(aryl ether ketone) resin (A) and the poly(ether imide sulfone) resin (B) are compatibly mixed. The poly(aryl ether ketone) resin (A) is preferably a poly(ether ketone ketone) resin with a repeating unit (a-1) represented by the following formula (1A) and a repeating unit (a-2) represented by the following formula (2A), and the resin composition has one glass transition temperature.
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Polyimide Film-Forming Composition, Method of Preparing the Same, and Use Thereof
The present disclosure relates to a polyimide film-forming composition, a method of preparing the same, and a use thereof. According to the present invention, there is provided a polyimide film that has excellent isotropic property and scattering resistance, is flexible, and has excellent bendability without deterioration of colorless and transparent optical properties. The polyimide film may be usefully used in various flexible display devices.
Methods for the manufacture of polyetherimides and polyetherimides made by the method
A method of manufacturing an isolated polyetherimide composition includes combining an as-synthesized polyetherimide comprising units of the formula (I) and a melt-stabilizing amount of a tri(C.sub.8-30 acyl) glyceride, an anhydride of the formula (II), or a combination comprising at least one of the foregoing, to provide a mixture; and isolating a polyetherimide composition from the mixture to provide the isolated polyetherimide composition having a change in complex viscosity measured over 30 minutes at 390° C., at a shear rate of 6.28 rad/seconds, strain=5%, and under nitrogen, from +15 to −20%, preferably from +10 to −20%, more preferably from +5 to −20%. ##STR00001##
Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device
The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.
Polyamic acid solutions, polyimide films and electronic devices
A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.
METHOD OF MAKING A BIPHENOL DIANHYDRIDE COMPOSITION, METHOD FOR PURIFICATION OF A BIPHENOL DIANHYDRIDE, AND POLY(ETHERIMIDE)S DERIVED FROM THE BIPHENOL DIANHYDRIDE
A method of making a biphenol dianhydride composition includes heating a first solution including a biphenol tetraacid of the formula (I) wherein Ra, Rb, p and q are as defined herein; at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, phosphate ions, sulfate ions, chloride ions, nitrate ions, and nitrite ions; and a non-halogenated solvent. The first solution is heated under conditions effective to provide a second solution including the corresponding biphenol dianhydride, the at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, phosphate ions, sulfate ions, chloride ions, nitrate ions, and nitrite ions, and the non-halogenated solvent.
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TEMPERATURE SENSOR ELEMENT
There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, and the matrix resin constituting the temperature-sensitive film has a degree of molecular packing of 40% or more, as determined based on measurement by an X-ray diffraction method, according to expression (i): Degree of molecular packing (%)=100×(Area of peak derived from ordered structure)/(Total area of all peaks).
Composition, electro-optic material, electro-optic device, and method for preparing electro-optic material
A composition for preparing an electro-optic material including a first polyimide having a high molecular weight, and a second polyimide having a lower molecular weight and including a structural unit including a chromophore functional group in the side chain, an electro-optic material including the composition, an electro-optic device including the electro-optic material, and a method of preparing the electro-optic material.