The present invention relates to a polymer composite material comprising an aramid nanofiber (ANF), and a method for preparing same. More specifically, the present invention relates to an arylene ether-based polymer or arylene ether imide-based polymer composite material which is obtained by mixing an arylene ether-based polymer or an arylene ether imide-based polymer with aramid nanofibers dispersed in a polar aprotic solution or by adding and polymerizing monomers in the dispersion of aramid nanofibers.

The present invention addresses the problem of providing a flexible electronic element substrate comprising a polyimide layer that has both low ultraviolet transmittance and high visible light transmittance and that is capable of suppressing ultraviolet degradation without any reduction in the performance of an electronic element. In order to solve this problem, the flexible electronic element substrate comprises a polyimide layer that satisfies all of (1) through (3) below: (1) maximum transmittance at a wavelength of 400±5 nm is 70% or higher at a thickness of 5 μm; (2) the b* value in an L*a*b* color system is 5 or less at a thickness of 5 μm; and (3) transmittance of light at a wavelength of 350 nm is 10% or less at a thickness of 5 μm.

The present invention provides curable, high molecular weight (>20,000 Daltons) polyimide compounds. The polyimides, once cured, possess a wide range of glass transition temperatures, have high tensile strength and high elongation. Furthermore, the cured polyimides are hydrophobic, have high glass transition temperatures, low coefficient of thermal expansion, very low dielectric constant and very low dielectric dissipation factor.

Aspects of the present disclosure provide for bridgehead-substituted triptycene-based diamines and methods of making bridgehead-substituted triptycene-based diamines.

To provide polyimide films that contain polyimide good in solubility in solvent and excel lent in workability and that are colorless, transparent and excellent in toughness, polyimide varnishes, and products and layered products using the polyimide film, the polyimide film is characterized by containing polyimide expressed by following general formula (1), and containing as A in the general formula (1), a structure expressed by following general formula (A-1), for example, structure expressed by following general formula (A-5). ##STR00001## Herein, in the general formula (1), A represents a bivalent organic group, B represents a tetravalent organic group, and n is 2 or more. ##STR00002##

An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape after development, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a negative photosensitive resin composition that forms the film. The negative photosensitive resin composition contains an (A) alkali-soluble resin, a (C1) photo initiator, and a (Da) black colorant, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor, and has a structural unit having a fluorine atom at a specific ratio, and the (C1) photo initiator contains an (C1-1) oxime ester-based photo initiator that has a specific structure.

In a first aspect, a low haze polyimide film includes, a dianhydride, a diamine, and a color-tuning compound. The low haze polyimide film has a thickness in a range of from 1 to 150 um, an a* closer to zero with a |Δa*| greater than 0.2 and a b* that is at most 0.2 further away from zero, or a b* closer to zero with a |Δb*| greater than 0.2 and an a* that is at most 0.2 further away from zero, when compared to a low haze polyimide film of the same dianhydride and diamine composition, but without the color-tuning compound, and a haze of less than 4%. In a second aspect, an electronic device includes the low haze polyimide film of the first aspect.

The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the thermosetting polyimide resin. The disclosure provides the thermosetting polyimide resin and the prepolymer, for manufacturing a film, an adhesive sheet, a cover film, a redistribution layer, a build-up board, a prepreg sheet, a high-frequency substrate, an integrated circuits carrier board, an adhesive for copper foil, a semiconductor packaging material, a radome, a substrate for server, a substrate for base station, a substrate for vehicle, etc.

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

A polyetherimide composition includes a polyetherimide and two or more of a residual metal content, a sulfate anion, a phosphate anion, a nitrite anion, a nitrate anion, or a combination including at least one of the foregoing, a residual solvent content, a phosphorus-containing stabilizer, and alkali metal halide, alkaline earth metal halide, alkali metal carbonate, or a combination including at least one of the foregoing, wherein each of the aforementioned components, when present, is included in the composition in a particular amount. The resulting polyetherimide composition exhibits two or more useful properties. The polyetherimide composition can optionally further be combined with a polymer different from the polyetherimide to provide a thermoplastic composition. Methods of making the polyetherimide composition and articles including the polyetherimide composition are also described.