Patent classifications
C08G73/106
Atomic Oxygen-Resistant, Low Drag Coatings and Materials
Coatings and materials that are atomic oxygen resistant and have an atomically smooth surface that can reduce drag are disclosed. The coatings and materials can be used on at least a portion of a spacecraft intended to operate in harsh environments, such as stable Earth orbits at about 100 km to about 350 km.
POLY(ETHERIMIDE-SILOXANE)/POLY(PHTHALAMIDE) COMPOSITIONS, ARTICLES PREPARED THEREFROM, AND METHODS FOR THE MANUFACTURE THEREOF
A thermoplastic composition includes a poly(phthalamide), a poly(etherimide-siloxane), and optionally, an additive composition. The respective amounts of each component are further described herein. A method for the manufacture of the composition includes melt-mixing the components of the composition, and optionally, extruding the composition. Articles including the thermo-plastic composition are also described.
CORE-SHELL FILAMENT, METHOD OF FORMING A CORE-SHELL FILAMENT, METHOD OF FORMING AN ARTICLE BY FUSED FILAMENT FABRICATION, AND ARTICLE FORMED FILAMENT FABRICATION
A core-shell filament useful for fused filament fabrication includes a core, and a shell surrounding and in contact with the core. The core contains a block polyetherimide-polysiloxane. The shell contains a polyetherimide. When the filament is used in fused filament fabrication for printing a three-dimensional article, the core material remains surrounded by shell material. So, the printed article exhibits good interlayer adhesion provided by the shell material, and good ductility provided by the core material.
Polyimide composition for package structure, package structure and method of fabricating the same
A polyimide composition for a package structure is provided. The polyimide composition includes a polyimide precursor, a cross-linker, a photosensitizer, a first additive, a second additive and a solvent. The first additive comprises a polyether based compound, and the second additive comprises a siloxane based compound. The polyimide composition has more than 98% cyclization of the polyimide precursor when the polyimide composition is cured at a temperature range of 160 C. to 200 C.
PROCESS FOR PRODUCING A THREE-DIMENSIONAL OBJECT
A process for producing a three-dimensional object by selectively layer-by-layer solidification of a powdery material layer at the locations corresponding to the cross-section of the object in a respective layer by exposure to electromagnetic radiation. The powdery material comprises at least one polymer which is obtainable from its melt only in substantially amorphous or completely amorphous form, or a polyblend which is obtainable from its melt only in substantially amorphous or completely amorphous form. The powdery material has a specific melting enthalpy of at least 1 J/g.
RESIN COMPOSITION, LAMINATE AND MANUFACTURING METHOD THEREOF, ELECTRODE, SECONDARY BATTERY, AND ELECTRIC DOUBLE LAYER CAPACITOR
An object of the present invention is to provide a resin composition containing: (a) a resin containing at least one of a polyimide, a polyamideimide, and a polybenzoxazole, having at least one acidic functional group among a phenolic hydroxyl group, a carboxyl group, and a sulfonic acid group in a side chain, and having an acidic functional group concentration of 3.4 mol/kg or more; and (b) a basic compound. The resin composition has high long-term stability in the form of an aqueous solution while having high strength and high modulus, has good dispersibility of a filler, and has a good binding property as a binder.
Polymers and resin composition employing the same
A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): ##STR00001##
wherein Y.sub.1 and Y.sub.2 are independently H, CH.sub.3, or CH.sub.2CH.sub.3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.
Aliphatic polyimides from unsaturated monoanhydride or unsaturated diacid reacted with both monoamine and diamine
Aliphatic polyimides are synthesized by a reaction of 2 moles of an unsaturated monoanhydride or an unsaturated diacid with both one mole of a diamine and one mole of a monoamine. Imidization of intermediates so formed from those reactions resolve to 6 possible bicyclic imidic structures bridged by monoamidic or saturated hydrocarbon spans, more likely the latter. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.
Photosensitive colored resin composition
The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.
Photosensitive polyimide resin composition and method of manufacturing cover film using the same
A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): ##STR00001## wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.