The present invention provides a random or block polyimide-siloxane copolymer, which may be prepared from a hard amine monomer, a dianhydride monomer, and a soft amine monomer, may have mechanical properties, flexibility, and thermal properties adjusted through the control of soft amine content, and may exhibits high thermal stability, corrosion resistance, transparency and flexibility, and a method for preparing the same. The random or block polyimide-siloxane copolymer, which may be flexible and thermally stable and may exhibits adjustable mechanical properties and skin-like sensory functions, may be applied to flexible electronic devices.

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

A polyimide precursor includes a repeating unit of formulae (I) and (II):

##STR00001## where R1 and R3 are each a tetravalent group of a tetracarboxylic dianhydride residue, and R2 and R4 are respectively a divalent group of a residue of a first-type diamine and a divalent group of a residue of a second-type diamine. The first-type diamine is represented by formula (III), and the second-type diamine is represented by formula (IV). A resin composition including the polyimide precursor, a polyimide formed from the polyimide precursor, and use of the polyimide are also disclosed.

A thermoplastic composition includes 25 to 95 weight percent of a poly(etherimide); 5 to 70 weight percent of a polymer different from the poly(etherimide) that is partially miscible with the poly(etherimide); and 1 to 15 weight percent of a mineral filler having an average particle size of 0.1 to 10 micrometers; wherein each weight percent is based on the total weight of the composition. The thermoplastic composition can be prepared by melt-mixing the components of the composition. Articles including the composition are also described.

Provided are a solid electrolyte composition containing an inorganic solid electrolyte having a conductivity of an ion of a metal belonging to Group I or II of the periodic table and a binder having a specific hydrocarbon polymer segment and a specific segment, a solid electrolyte-containing sheet in which the same solid electrolyte composition is used and a manufacturing method therefor, an all-solid state secondary battery and a manufacturing method therefor, a polymer having a specific hydrocarbon polymer segment and a specific segment, and a non-aqueous solvent dispersion thereof.

The present invention provides a polyimide precursor solution which can enhance the uniformity of a polyimide film and also improve the efficiency of processes by improving liquid curl in a coating process of the polyimide precursor solution. In addition, since polyimide according to the present invention has excellent transparency, heat resistance, mechanical strength and flexibility by comprising a specific structure, the polyimide may be used in various fields, such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, flexible printed circuits (FPCs), tapes, touch panels, protective films for optical discs, etc.

A polyimide precursor composition according to the present invention enables alleviation of thermal expansion-contraction properties of a polyimide film resultingly prepared, by means of using siloxane-based diamine having a particular structure and a solvent having a positive partition coefficient. And the present invention enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.

A method of making a three-dimensional object comprising one or more polyimide copolymers, polyimide composites or combinations thereof is provided. The method involves 3D printing a solution comprising polyamic acid (PAA), tetraethyl orthosilicate (TEOS), and a silane selected from the group consisting of aminopropyl trimethoxysilane (APTMS), aminopropyl triethoxysilane (APTES), N-[3-(trimethoxysilyl)propyl]-ethylene diamine (ETDA), and glycidoxypropyl trimethoxysilane (GPTMS) to produce a three-dimensional form, and thermosetting the three-dimensional form.

A polyamideimide resin containing a structural unit (Ia) represented by a formula shown below, and a structural unit (IIa) represented by a formula shown below. In the formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon, atoms, and alkoxy groups and hydroxyalkyl groups of 1 to 9 carbon atoms. In the formula (IIa), each R independently represents a hydrogen atom, or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and n represents an integer of 1 to 6.

##STR00001##

A polyimide resin composition containing a polyimide resin (A) and a polyetherimide sulfone resin (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %; and a molded article containing the same.

##STR00001##

(R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)